Wafer Laser Inspection Recipe Control for Faster Condition Setup
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing inspection devices for wafers require repeated adjustments of laser processing conditions to determine appropriate settings, making the process inefficient and time-consuming.
Innovation Solution
An inspection device with an irradiation part, imaging part, and control part that receives wafer processing information to automatically determine and optimize laser processing conditions based on input data, allowing for real-time evaluation and correction of processing results.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual repeated adjustments of laser processing conditions are performed to determine appropriate settings, then processing condition optimization can be achieved, but time consumption and operational efficiency deteriorate
Solution Approach 1:
The system performs preliminary actions by automatically determining processing conditions through image recognition and analysis before actual laser processing begins. The inspection device captures images of the wafer, analyzes them to identify processing targets and determine optimal parameters, and prepares the processing condition in advance, eliminating the need for time-consuming manual trial-and-adjustment cycles during actual production.
Solution Approach 2:
The system enables self-service by allowing the inspection device to automatically determine processing conditions without human intervention. The control unit autonomously analyzes wafer images, identifies processing targets, calculates optimal laser parameters, and outputs processing conditions, making the system self-sufficient and eliminating dependency on manual operator adjustments.
2Manufacturing precision
If manual repeated adjustments of laser processing conditions are performed, then appropriate processing settings can be derived, but operational complexity and manual involvement increase
Solution Approach 1:
The system enables self-service by allowing the inspection device to automatically determine processing conditions without human intervention. The control unit autonomously analyzes wafer images, identifies processing targets, calculates optimal laser parameters, and outputs processing conditions, making the system self-sufficient and eliminating dependency on manual operator adjustments.
Solution Approach 2:
The system replaces manual mechanical adjustment operations with automated image recognition and computational analysis. Instead of operators physically adjusting laser parameters based on experience and trial-and-error, the control unit uses optical imaging and algorithmic processing to automatically determine optimal settings, substituting human mechanical operations with automated intelligent systems.
3Productivity
If automatic determination of processing conditions is implemented based on image analysis, then time efficiency and productivity improve, but measurement precision requirements and system complexity increase
Solution Approach 1:
The system introduces an intermediary imaging system that captures visual information of the wafer surface and processing targets. This intermediary optical measurement system translates physical wafer characteristics into image data that the control unit can analyze, serving as a bridge between the physical domain and the computational domain, enabling automatic processing condition determination while maintaining measurement accuracy.
Solution Approach 2:
The system changes measurement parameters by transitioning from direct physical measurement to optical image-based measurement. The inspection device captures images at different wavelengths or focal depths to extract processing target information, transforming the measurement approach from contact-based or indirect methods to visual parameter extraction, thereby improving both speed and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and accurate determination of appropriate processing conditions, reducing the need for manual adjustments and improving the precision of laser processing results.
Implementation Method 1
an irradiation part (laser irradiation unit 3) configured to irradiate a wafer with a laser beam
Implementation Method 2
an imaging part (inspection imaging unit 4) configured to take an image of the wafer
Data Source
AI summary
This inspection device includes: a laser irradiation unit, an imaging unit that takes an image of a wafer, a display that receives an input, and a control part, wherein the display receives an input of wafer processing information including information of the wafer and a laser processing target for the wafer, and the control part is configured to determine a recipe (a processing condition) including an irradiation condition of the laser beam by the laser irradiation unit based on the wafer processing information received through the display, to control the laser irradiation unit so that the wafer is irradiated with the laser beam according to the determined recipe, to acquire a laser processing result of the wafer due to the irradiation of the laser beam by controlling the imaging unit to take an image of the wafer, and to evaluate the recipe based on the laser processing result.