Wafer-Type LED Frames for Precise Wavelength-Converting Layer Coating
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Solution Overview
Problem
Conventional LED production faces challenges in precisely controlling the thickness of the wavelength-converting fluorescent layer, leading to lower yields and higher costs due to inconsistent coating.
Innovation Solution
A wafer-type light emitting device with a substrate, light emitting semiconductors, and a wavelength-converting layer confined by frames, allowing for precise application and distribution of the fluorescent mixture, which is then diced into individual units, enabling uniform correlated color temperatures and reduced particle dosage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fluorescent layer is coated on the LED to convert wavelengths, then the light emitting device can convert wavelengths, but the thickness of the fluorescent layer cannot be controlled precisely
Solution Approach 1:
The patent segments the fluorescent layer application process by introducing a frame structure that divides the coating area into controlled zones. The frame creates discrete regions where fluorescent material can be precisely deposited and contained, preventing uncontrolled spread and enabling accurate thickness control across the LED surface.
Solution Approach 2:
The frame acts as an intermediary element between the coating process and the LED surface. It provides a physical boundary that mediates the deposition process, ensuring fluorescent material is confined to specific areas and deposited at controlled thicknesses, thereby improving manufacturing precision and yield.
2Reliability
If the fluorescent layer thickness is not precisely controlled, then coating process is simpler, but the production yield decreases and cost increases
Solution Approach 1:
The frame structure is pre-installed on the LED before the fluorescent coating process. This preliminary action creates predefined boundaries that guide the subsequent coating process, ensuring precise material placement without requiring complex real-time control mechanisms during deposition.
Solution Approach 2:
The frame enables local quality control by creating distinct zones with specific coating requirements. Each region within the frame can be optimized for precise thickness control, while the overall structure remains relatively simple. This localized approach improves yield without significantly increasing global process complexity.
3Manufacturing precision
If more fluorescent material is used to ensure adequate coverage, then coating uniformity improves, but material usage increases and cost rises
Solution Approach 1:
The frame structure enables precise local application of fluorescent material, ensuring uniform coverage only where needed. By confining the coating process within frame boundaries, the patent achieves consistent thickness and uniformity without requiring excessive material, thereby reducing waste and production costs.
Solution Approach 2:
The frame serves as an intermediary that controls material distribution. It guides the fluorescent coating process to deposit material uniformly within confined areas, preventing both under-coating and over-coating. This mediation achieves adequate coverage with optimized material usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves yield and reduces production costs by ensuring uniform light emission and correlated color temperatures through precise application and confinement of the wavelength-converting layer, enhancing light emitting efficiency and reducing material usage.
Implementation Method 1
a fluorescent layer is coated on the LED to convert the wavelengths of emitted lights. As a result, the fluorescent layer is also called a wavelength-converting layer
Data Source
AI summary
The invention relates to a wafer-type light emitting device having a substrate, one or more light emitting semiconductors formed on the substrate, one or more frames provided over the one or more light emitting semiconductors, and one or more wavelength-converting layers applied on the one or more light emitting semiconductors and confined by the one or more frames, wherein the wafer-type light emitting device is diced into a plurality of separate light emitting units.