Wafer Lens Array Camera for Reduced Z-Axis Depth
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Solution Overview
Problem
Conventional digital imaging devices face limitations due to a large depth of field (Z axis) that restricts their applications and uses, particularly in space-constrained environments, as they require a larger image plane and focal length to achieve high-resolution images.
Innovation Solution
The implementation of a wafer lens array that partitions the image sensor into subsections, with each lens focusing image light onto corresponding sensor subsections, allowing for a reduced lens depth while maintaining high-resolution image capture through super-resolution image generation by combining pixel data from these subsections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional lens with large focal length is used to achieve high-resolution images, then image quality is improved, but the Z axis dimension (lens depth) increases
Solution Approach 1:
The patent divides the image sensor into multiple sensor subsections and uses a wafer lens array where each lens corresponds to one subsection. This segmentation allows each lens to have a shorter focal length while collectively covering the entire sensor area, thereby reducing the overall lens depth (Z axis dimension) while maintaining high-resolution image capture capability across the full sensor.
2Length of moving object
If the image plane size is reduced to decrease lens depth, then Z axis dimension is improved, but image resolution deteriorates
Solution Approach 1:
The patent transitions from a single large image plane to multiple smaller sensor subsections arranged in a spatial array. By utilizing the dimensional arrangement of multiple subsections and corresponding lenses, the system achieves reduced lens depth while maintaining overall image resolution through the combined data from all subsections.
3Measurement precision
If conventional lens configuration is used, then high-resolution imaging is achieved, but space constraints are worsened
Solution Approach 1:
By segmenting both the lens system into a wafer lens array and the sensor into multiple subsections, the patent reduces the volume occupied by each individual lens element and its associated optical path. The compact wafer-scale lens array maintains high-resolution imaging capability while significantly reducing the overall space requirements compared to a single conventional lens system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the capture of high-resolution images with a significantly smaller Z axis dimension compared to conventional cameras, enhancing the depth of field and reducing space requirements, while also increasing the percentage of usable pixels for improved image resolution.
Implementation Method 1
each lens focusing image light onto corresponding sensor subsections
Data Source
AI summary
An imaging device includes an image sensor and an array of wafer lenses. The image sensor has rows and columns of pixels partitioned into an array of sensor subsections. The array of wafer lenses is disposed over the image sensor. Each of the wafer lenses in the array of wafer lenses is optically positioned to focus image light onto a corresponding sensor subsection in the array of sensor subsections. Each sensor subsection includes unlit pixels that do not receive the image light focused from the wafer lenses and each sensor subsection also includes lit pixels that receive image the image light focused by the wafer lenses. A rectangular subset of the lit pixels from each sensor subsection are arranged to capture images.