Wafer-Level Lens IR Cutoff Filter Bonding to Prevent Voids
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Solution Overview
Problem
In existing camera modules, the lack of an adhesive agent between the infrared cutoff filter and the glass substrate leads to void generation, causing deterioration in optical characteristics and image defects.
Innovation Solution
An imaging element with a frame formed from an inorganic material at the outer peripheral portion of the light receiving sensor, where the infrared cutoff filter layer is bonded to the frame using an adhesive agent, ensuring no voids are created between the filter and the sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the glass substrate is bonded to the infrared cutoff filter after curing the filter formed by spin coating without an adhesive agent, then the manufacturing process is simplified, but voids are generated between the filter and substrate causing deterioration in optical characteristics
Solution Approach 1:
An adhesive agent layer is introduced between the infrared cutoff filter and the glass substrate to act as an intermediary that ensures complete contact and bonding. This mediator prevents void formation while maintaining a relatively simple manufacturing process, thus resolving the contradiction between manufacturing simplicity and optical reliability.
2Device complexity
If no adhesive agent is used between the infrared cutoff filter and the glass substrate, then the device structure is simplified, but voids occur causing image defects
Solution Approach 1:
The adhesive agent serves as a mediator that eliminates harmful voids between the filter and substrate. Although it adds a layer to the structure, the overall complexity remains low while effectively preventing image defects caused by voids.
3Productivity
If the infrared cutoff filter is formed by spin coating and cured without adhesive bonding, then the manufacturing steps are reduced, but clearance gaps are generated leading to deterioration in optical characteristics
Solution Approach 1:
The adhesive agent layer acts as a mediator that enables complete bonding between the spin-coated filter and the substrate. This allows the manufacturing process to maintain high efficiency while achieving the precision required for good optical characteristics by eliminating clearance gaps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses void generation, enhancing optical performance and preventing image defects by ensuring a solid bond between the infrared cutoff filter and the light receiving sensor.
Implementation Method 1
bonding the frame and the infrared cutoff filter layer that are formed on the same plane to the light receiving sensor by an adhesive agent
Implementation Method 2
an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame
Data Source
AI summary
The present technology relates to an imaging element, a method of manufacturing the imaging element, and an electronic apparatus that make it possible to suppress generation of a void in an infrared cutoff filter layer. The imaging element includes: a light receiving sensor that performs photoelectric conversion of incoming light; a cover glass that protects a top surface side serving as a light incidence surface of the light receiving sensor; a frame that is disposed in an outer peripheral portion between the light receiving sensor and the cover glass, and is formed with use of an inorganic material; and an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame. The present technology is applicable to, for example, an imaging element having a CSP structure, and the like.