Wafer-Level Lens Structure for Void-Free Infrared Cutoff Filters
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Solution Overview
Problem
In existing camera modules, the lack of an adhesive agent between the infrared cutoff filter and the glass substrate leads to void generation, causing deterioration in optical characteristics and image defects.
Innovation Solution
An imaging element is designed with a frame formed from an inorganic material at the outer peripheral portion of the light receiving sensor, where the infrared cutoff filter layer is formed on the same plane as the frame, and both are bonded to the sensor using an adhesive agent, preventing void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the infrared cutoff filter is bonded to the glass substrate without an adhesive agent, then the manufacturing process is simplified, but voids are generated between the filter and substrate
Solution Approach 1:
An adhesive agent layer is introduced between the infrared cutoff filter and the glass substrate to act as an intermediary bonding medium. This adhesive layer fills the gaps and bonds the filter to the substrate, preventing void formation while maintaining a relatively simple manufacturing process.
2Device complexity
If the infrared cutoff filter is bonded to the glass substrate without an adhesive agent, then the device structure is simplified, but optical characteristics deteriorate due to voids
Solution Approach 1:
The adhesive agent serves as a mediator that ensures reliable optical contact between the infrared cutoff filter and the glass substrate. By eliminating voids, the adhesive layer preserves the optical characteristics and reliability of the imaging device while adding only a thin functional layer to the structure.
3Quantity of substance
If the infrared cutoff filter is bonded to the glass substrate without an adhesive agent, then the material usage is reduced, but image defects occur due to voids
Solution Approach 1:
A thin layer of adhesive agent is applied as an intermediary substance that prevents void formation and the associated image defects. The adhesive layer is sufficient to eliminate harmful voids and ensure proper optical contact without requiring excessive material, thus minimizing the quantity of substance while preventing image defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses void generation in the infrared cutoff filter layer, enhancing optical characteristics and preventing image defects, while also providing improved reliability and substrate rigidity.
Implementation Method 1
bonding the frame and the infrared cutoff filter layer that are formed on the same plane to the light receiving sensor by an adhesive agent
Implementation Method 2
an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame
Data Source
AI summary
The present technology relates to an imaging element, a method of manufacturing the imaging element, and an electronic apparatus that make it possible to suppress generation of a void in an infrared cutoff filter layer. The imaging element includes: a light receiving sensor that performs photoelectric conversion of incoming light; a cover glass that protects a top surface side serving as a light incidence surface of the light receiving sensor; a frame that is disposed in an outer peripheral portion between the light receiving sensor and the cover glass, and is formed with use of an inorganic material; and an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame. The present technology is applicable to, for example, an imaging element having a CSP structure, and the like.