Wafer Lens Stacking Position Calculation for Optical Axis Alignment
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Solution Overview
Problem
Conventional methods for bonding wafer lens arrays rely on alignment marks, which can lead to optical axis deviation if lens positions are deviated, resulting in reduced yield due to excessive positional errors exceeding allowable ranges.
Innovation Solution
A lens substrate stacking position calculating apparatus that calculates the relative positional relationship between transparent substrates using a common coordinate system, employing methods like random search or RANSAC to maximize the number of lens sets within allowable optical axis deviation ranges, even when lens positions are deviated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If bonding is performed with reference to alignment marks assuming lens positions are the same for all wafers, then the bonding process is simple and efficient, but optical axis deviation occurs when lens positions are deviated between wafer lens arrays
Solution Approach 1:
The patent measures the actual positions of lenses on each wafer substrate before bonding and calculates the optimal stacking position in advance. This preliminary measurement and calculation step allows the bonding process to compensate for position deviations, ensuring optical axis alignment while maintaining efficient bonding operations.
Solution Approach 2:
The patent changes the bonding reference from fixed alignment marks to dynamically calculated stacking positions based on actual lens positions. By calculating the optimal stacking position that maximizes the number of lens sets within allowable deviation ranges, the system adapts to position variations while maintaining precision.
2Device complexity
If the positions of lenses on wafer substrates are not verified before bonding, then the manufacturing process is faster and simpler, but the number of lens sets with excessive optical axis deviation increases, reducing product yield
Solution Approach 1:
The patent implements preliminary measurement of lens positions on each wafer substrate and pre-calculation of optimal stacking positions before bonding. This advance preparation identifies and compensates for position deviations, ensuring high product yield without adding significant complexity to the manufacturing process.
Solution Approach 2:
The patent uses measured actual lens positions as feedback to calculate the optimal stacking position. This feedback mechanism allows the system to adjust the bonding process based on actual conditions, maximizing the number of lens sets within allowable deviation ranges and improving product yield.
Data Source
AI summary
The present invention provides a lens substrate stacking position calculating apparatus capable of calculating a stacking position at which the number of lens sets whose optical axis deviation falls within an allowable range is maximized, when a plurality of wafer lens arrays are bonded together even if the position of each lens formed on a wafer substrate is deviated between wafer lens arrays to be stacked. The lens substrate stacking position calculating apparatus calculates the positional relationship of two or more transparent substrates to be stacked when the two or more transparent substrates on which a plurality of lenses are two-dimensionally arranged are stacked to form a plurality of lens sets each including two or more lenses. A position of each lens is specified in advance in a common coordinate system.