Wafer-Level Camera Array for Vehicle Surround Monitoring
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Solution Overview
Problem
Commercial vehicles, due to their large dimensions and poor visibility, face challenges in maneuvering and safety due to limited all-round visibility, which can lead to accidents.
Innovation Solution
A device utilizing multiple wafer-level cameras arranged in a line around the vehicle to capture overlapping images, processed into a bird's-eye view, providing an enhanced all-round view for the driver without the need for complex panning mechanisms, and allowing for adjustable focal lengths and stereoscopic imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional cameras with individual lens assembly are used, then image quality can be maintained, but device complexity and production cost increase due to complex panning mechanisms and individual lens alignment
Solution Approach 1:
The patent divides the vehicle surroundings monitoring into multiple fixed camera units positioned at different locations (front, rear, left, right sides). Each camera captures a specific sector, and the image processing unit combines these segmented views into a comprehensive bird's-eye view, eliminating the need for single-camera panning mechanisms.
Solution Approach 2:
The patent transitions from a single-camera system requiring mechanical panning in two dimensions to a multi-camera fixed-array system capturing three-dimensional spatial information simultaneously. This dimensional approach allows comprehensive coverage without mechanical movement.
2Reliability
If multiple conventional cameras are used to capture overlapping areas, then complete surround coverage is achieved, but production cost and assembly complexity increase
Solution Approach 1:
The patent changes the physical parameters of the camera modules by using wafer-level cameras with integrated lenses directly bonded to sensor substrates. This reduces the overall camera module size and enables fixed positioning without complex alignment mechanisms, maintaining complete surround coverage while simplifying manufacturing.
Solution Approach 2:
The patent uses identical wafer-level camera modules replicated multiple times around the vehicle. Each module is a standardized copy with pre-integrated optics and sensors, simplifying assembly and reducing production costs compared to custom-assembled conventional cameras.
3Device complexity
If wafer-level cameras are used, then production cost and device size are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent merges the lens assembly and sensor substrate into a single wafer-level camera module. The lens is directly formed or bonded onto the sensor wafer, eliminating separate alignment steps and reducing manufacturing precision requirements compared to assembling multiple discrete components.
Solution Approach 2:
The patent replaces mechanical lens mounting and alignment mechanisms with direct wafer-level integration. Optical elements are positioned and fixed at the wafer fabrication stage using semiconductor manufacturing techniques, achieving high precision without mechanical adjustment mechanisms.
4Device complexity
If conventional cameras with mechanical panning are used, then single-unit simplicity is maintained, but reliability decreases due to moving parts
Solution Approach 1:
The patent segments the monitoring function into multiple fixed camera units, each with no moving parts. This segmentation trades a single complex mechanical system for multiple simple static systems, improving overall reliability while achieving the same functional goal of complete surround monitoring.
Data Source
Figure 1
AI summary
The invention relates to a device for monitoring an environment of a vehicle, wherein the environment is captured by means of a plurality of image capturing units, the capture ranges (2) thereof at least partially overlapping each other and forming an overlap range (3), wherein an overall image is generated from the individual images captured by means of the image capturing units, said overall image showing the vehicle and the environment thereof from a bird's-eye view. According to the invention, the image capturing units are designed as wafer-level cameras (1).