Wafer-Level Camera Module Packaging with Overmolded Light-Tight Housing
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Solution Overview
Problem
The high cost of packaging array cameras is a significant issue due to the need for precise alignment and light-tight housing of individual lenses and image sensors, which increases manufacturing costs, especially in consumer electronics and automotive applications.
Innovation Solution
A wafer-level packaging method that overmolds a housing material around image sensors and lenses to form a wafer of packaged camera modules, eliminating the need for separate alignment and bonding steps, and using opaque housing material to create light-tight enclosures without external light leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional separate alignment and bonding steps are used for packaging camera modules, then manufacturing precision is improved, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent combines multiple separate packaging steps (alignment, bonding, housing formation) into a single wafer-level packaging process. Multiple image sensors and lens units are packaged simultaneously on the wafer substrate in one operation, eliminating the need for repeated alignment and bonding steps for each individual component, thereby improving both precision and productivity
2Manufacturing precision
If traditional individual packaging methods are used for each camera module, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple individual packaging operations into a single wafer-level process where multiple camera modules are packaged simultaneously. This批量 processing approach maintains alignment precision through the wafer substrate while dramatically reducing per-unit manufacturing cost by eliminating repetitive setup and handling for each individual module
3Ease of manufacture
If wafer-level packaging is used to reduce cost, then manufacturing cost decreases, but ensuring light-tight enclosure becomes more difficult
Solution Approach 1:
The housing structure formed in the wafer-level packaging process serves multiple functions simultaneously: it provides mechanical support for the sensors and lenses, creates the light-tight enclosure by filling gaps and seams with housing material, and enables subsequent dicing into individual modules. This multi-functional housing design ensures light-tightness is achieved as an integral part of the packaging process rather than as a separate operation
Data Source
AI summary
A wafer-level method for packaging a plurality of camera modules includes (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) seating a plurality of lens units in the first wafer above the plurality of image sensors, respectively, and (d) overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules, wherein each of the packaged camera modules includes one of the image sensors and one of the lens units, and the second housing material cooperates with the first housing material to secure the lens units in the second wafer.