Wafer-Level Chip Connection via Height Equalization
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Solution Overview
Problem
The miniaturization of electrical components, such as MEMS components, poses challenges in connecting chips with complex structures, as the lower side of one chip with functional structures no longer provides a level surface, making uniform connections difficult due to height differences in contact structures.
Innovation Solution
The introduction of an adaptation structure on the upper side of one chip, which equalizes the height difference between the connecting and contact structures on both chips, allowing for a homogeneous connection and production at the wafer level using lithographic methods, thereby simplifying the connection process and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If chips with complex functional structures are used, then the functionality and performance of the component are improved, but the lower side of the chip no longer provides a level surface, making uniform connection more difficult
Solution Approach 1:
The patent introduces an adaptation structure as an intermediary element between the first chip and the second chip. This adaptation structure compensates for the height differences caused by complex functional structures on the second chip, providing a level connection surface. The adaptation structure acts as a mediator that enables uniform mechanical and electrical connections while accommodating the complex functionality of both chips.
Solution Approach 2:
The patent solves the connection uniformity problem by transitioning from a two-dimensional planar connection to a three-dimensional solution. The adaptation structure introduces vertical dimensionality with its specific height, allowing the connection interface to accommodate height variations while maintaining uniform connection across the chip surfaces.
2Productivity
If wafer-level production is implemented, then productivity and cost efficiency are improved, but the complexity of coordinating multiple chips with different heights increases
Solution Approach 1:
The adaptation structure is designed and positioned in advance during the wafer-level production process, before the actual chip connection takes place. This preliminary action of pre-configuring the adaptation structure with the correct height compensates for height differences, simplifying the subsequent chip coordination and connection processes in wafer-level production.
3Adaptability or versatility
If contact structures of different heights are used to accommodate functional structures, then the functionality is preserved, but uniform mechanical connection becomes more difficult
Solution Approach 1:
The adaptation structure serves as a mediator that enables uniform mechanical connection while preserving functional structure accommodation. By providing a level connection surface, it allows contact structures of different heights to be connected uniformly to the first chip, maintaining both functional versatility and mechanical connection strength.
Data Source
AI summary
A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.