Wafer-Level Endoscope Camera Module Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional endoscopes are bulky and costly, with image pickup apparatuses that are not optimized in size or placement, leading to suboptimal image quality and increased burden on test subjects due to larger sizes and inefficient use of space.
Innovation Solution
A camera module is formed at a wafer level by aligning and bonding a lens wafer with optical parts and a sensor wafer, then separated into individual pieces, allowing for a smaller, more cost-effective image pickup apparatus with optimal placement of functional elements, such as LEDs and image sensors, to achieve a downsized and balanced illumination system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional image pickup apparatuses are used in endoscopes, then image pickup function is achieved, but the endoscope size becomes large and manufacturing cost increases
Solution Approach 1:
The image pickup apparatus is segmented into separate functional modules: lens module, sensor module, and illumination module. Each module is independently optimized and manufactured, then integrated into the endoscope. This segmentation allows for smaller individual components and reduced overall endoscope size while enabling specialized manufacturing processes for each module, reducing overall manufacturing cost.
Solution Approach 2:
The illumination modules are positioned in nested arrangements around the optical axis, with multiple illumination modules arranged concentrically. This nesting approach maximizes space utilization within the limited endoscope diameter, providing comprehensive illumination without increasing the overall endoscope size proportionally.
2Manufacturing precision
If conventional image pickup apparatuses are used in endoscopes, then image pickup function is achieved, but image quality is suboptimal due to non-optimal placement of functional elements
Solution Approach 1:
Different regions of the endoscope are optimized for specific functions: the distal end contains the lens and sensor with precise optical alignment for high-quality image capture, while the surrounding regions contain illumination modules positioned at optimal angles and distances. Each functional element is placed in its optimal location rather than using a uniform design, achieving superior image quality.
3Object-affected harmful factors
If conventional image pickup apparatuses are used in endoscopes, then image pickup function is achieved, but test subjects experience increased burden due to larger size
Solution Approach 1:
The endoscope employs a flexible insertion portion with adjustable bending capabilities, allowing the distal end to be dynamically positioned and oriented during procedures. This dynamic flexibility enables the use of a smaller distal end portion while maintaining full functional capability, reducing the burden on test subjects during insertion and operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a smaller, more affordable endoscope with improved image quality and reduced burden on test subjects, as the camera module's compact design allows for better light distribution and increased illumination, enhancing the overall performance and usability of the endoscope.
Implementation Method 1
aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer
Data Source
AI summary
An endoscope apparatus includes a polygonal camera module integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the aligned and bonded lens wafer and sensor wafer into individual pieces, wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion.