Wafer-Level Focus Compensation Standoffs for Optical Imaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The traditional manufacturing method of solid state camera modules involves serial focus adjustment, leading to inefficiencies and increased costs and time, especially when producing high volumes.
Innovation Solution
The method involves wafer-level assembly with focus compensation standoffs to set optical elements at the desired height relative to the image plane, allowing for cost and time-efficient production of optical imaging apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If serial focus adjustment is used for each module, then manufacturing precision of focus is improved, but productivity deteriorates significantly
Solution Approach 1:
Multiple individual focus adjustment operations are merged into a single wafer-level operation. The patent integrates focus compensation for multiple optical elements onto a single wafer substrate, allowing simultaneous adjustment of all elements rather than sequential adjustment of each module individually.
Solution Approach 2:
The invention transitions from one-dimensional serial processing (one module at a time) to two-dimensional parallel processing (multiple modules on a wafer). By arranging multiple optical elements on a wafer in a grid pattern, the system enables simultaneous fabrication and focus adjustment across numerous elements.
2Manufacturing precision
If serial manufacturing technique is used, then focus adjustment accuracy is improved, but manufacturing time increases
Solution Approach 1:
Focus compensation structures are incorporated into the wafer during the initial fabrication process rather than adding them later. The compensation elements are formed as part of the base wafer structure, allowing focus adjustment to occur automatically during subsequent assembly without requiring separate time-consuming operations.
Solution Approach 2:
The invention changes the physical parameters of the wafer structure by incorporating variable height compensation elements. These elements have different heights or thicknesses that correspond to the specific focus requirements of different optical elements, allowing precise focus control through structural parameter variation rather than mechanical adjustment.
3Productivity
If wafer level assembly is used, then productivity is improved, but device complexity increases
Solution Approach 1:
The wafer is segmented into multiple independent focus compensation zones, each corresponding to a specific optical element or module. This segmentation allows each region to be optimized independently while maintaining overall wafer-level integration, simplifying the design and fabrication process.
Solution Approach 2:
The patent introduces intermediary focus compensation structures that mediate between the optical elements and the final imaging plane. These compensation elements serve as intermediate components that automatically correct focus variations without requiring complex active control systems or post-fabrication adjustments.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Optical imaging apparatus are provided having the desired focal properties, which can be manufactured and/or assembled at the wafer level.