Wafer-Level Heat Sink Window Plate for Compact Die Cooling
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Solution Overview
Problem
Current heat conduction schemes for semiconductor devices, such as those used in non-volatile memory devices and high-performance processing units, are ineffective and add height to the overall package, making them unsuitable for portable electronics due to inefficient heat dissipation.
Innovation Solution
Integration of a heat sink window plate (HSWP) at the wafer level on semiconductor controller and memory dies, utilizing a multi-layered structure of materials like Chromium, Nickel, and Copper, with a thermally conductive adhesive, to facilitate efficient heat transfer while maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is mounted on top of the mold compound to draw heat away from the controller, then heat dissipation is improved, but the overall height of the controller increases and manufacturing complexity increases
Solution Approach 1:
The patent combines the heat sink function with the window plate by integrating a heat sink layer directly into the window plate structure. The window plate includes a base layer and a heat sink layer formed on the base layer, creating a unified component that serves both as a protective window and a thermal management solution. This eliminates the need for a separate heat sink mounted on the mold compound, thereby reducing overall controller height while maintaining effective heat dissipation.
Solution Approach 2:
The window plate is designed to perform multiple functions simultaneously: it provides mechanical protection for the controller, allows optical signals to pass through (window function), and dissipates heat through its integrated heat sink layer. This multi-functional design consolidates what would traditionally require separate components, reducing both height and manufacturing complexity while improving thermal management.
2Temperature
If a heat sink is mounted on top of the mold compound to draw heat away from the controller, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat sink function with the window plate by integrating a heat sink layer directly into the window plate structure. The window plate includes a base layer and a heat sink layer formed on the base layer, creating a unified component that serves both as a protective window and a thermal management solution. This eliminates the need for a separate heat sink mounted on the mold compound, thereby reducing overall controller height while maintaining effective heat dissipation.
Solution Approach 2:
The heat sink layer is formed on the window plate during the wafer fabrication process before the controller is packaged. This preliminary integration of the heat sink function into the window plate structure during manufacturing simplifies the overall device assembly and reduces the number of subsequent assembly steps required, thereby reducing manufacturing complexity.
3Temperature
If traditional heat conduction schemes are used, then heat dissipation is attempted, but the schemes are not very effective at removing heat from the controller
Solution Approach 1:
The window plate employs a composite structure with a base layer and a heat sink layer made of thermally conductive material. This composite design optimizes both mechanical properties (from the base layer) and thermal conduction properties (from the heat sink layer), creating a component that is both structurally sound and highly effective at heat dissipation.
Solution Approach 2:
The heat sink layer is strategically positioned on the window plate directly overlying the controller die, concentrating thermal management capabilities where they are most needed. This localized approach to heat dissipation maximizes effectiveness by placing the heat sink function closest to the heat source while maintaining a simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The HSWP effectively dissipates heat from controller and memory dies, maintaining device compactness and enhancing thermal management without increasing package height, thus improving performance and reliability in portable electronics.
Implementation Method 1
one or more heat sink window plates (HSWPs) each having first and second surfaces, the first surface formed on one or more of a surface of the controller die and a surface of the uppermost memory die of the one or more memory dies
Implementation Method 2
utilizing a multi-layered structure of materials like Chromium, Nickel, and Copper
Data Source
AI summary
A semiconductor device includes a semiconductor controller die and a stack of one or more semiconductor memory dies. In one example, the controller die may have an integrated heat sink window plate, or HSWP, formed on top of the die. In other examples, an uppermost memory die in the stack of memory dies may include an integrated HSWP. The HSWP may be formed on the controller die and/or the memory die at the wafer level.