Wafer-Level Image Sensor Assembly for Batch Manufacturing
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Solution Overview
Problem
The existing manufacturing process for electronic devices with optical sensor modules is inefficient and time-consuming, particularly in mass production, due to the multi-step process and individual testing required for each device.
Innovation Solution
A method involving wafer-level processing (WLP) is introduced, where a sensor layer with image sensor integrated circuits (ICs) is formed, bonded with a spacer layer and a lens layer, and then diced to produce multiple image sensor devices, allowing for batch processing and reducing manufacturing time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional multi-step manufacturing process with individual assembly and testing is used, then each device can be individually quality-checked, but manufacturing time and complexity increase significantly
Solution Approach 1:
The patent merges multiple discrete manufacturing steps (sensor assembly, lens assembly, housing assembly, and testing) into a single integrated wafer-level processing step. Multiple image sensor devices are assembled and tested simultaneously on a wafer substrate, eliminating sequential operations and reducing total manufacturing time while maintaining quality through batch testing capabilities
Solution Approach 2:
The patent performs preliminary assembly of multiple image sensor devices onto a wafer substrate before final packaging. The sensor layer, lens layer, and housing are pre-assembled in aligned arrays on the wafer, allowing subsequent batch processing and testing to occur efficiently before the wafer is diced into individual devices
2Manufacturing precision
If traditional individual assembly methods are used, then each device can be precisely assembled, but manufacturing complexity and cost increase
Solution Approach 1:
The patent segments the manufacturing process into distinct wafer-level layers (sensor layer, lens layer, housing layer) that are independently prepared and then bonded together in a single alignment step. This segmentation allows each layer to be optimized separately while achieving precise final assembly through wafer-level bonding, reducing overall manufacturing complexity
Solution Approach 2:
The patent creates universal wafer-level assemblies that can produce multiple identical image sensor devices simultaneously. The wafer substrate serves multiple functions as both the mounting platform for sensors and the structural base for the entire assembly, while the batch processing approach universally applies to all devices on the wafer, reducing per-device complexity
Data Source
AI summary
A method of making image sensor devices may include forming a sensor layer including image sensor ICs in an encapsulation material, bonding a spacer layer to the sensor layer, the spacer layer having openings therein and aligned with the image sensor ICs, and bonding a lens layer to the spacer layer, the lens layer including lens in an encapsulation material and aligned with the openings and the image sensor ICs. The method may also include dicing the bonded-together sensor, spacer and lens layers to provide the image sensor devices. Helpfully, the method may use WLP to enhance production.