Wafer-Level Image Sensor Lens Integration
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Solution Overview
Problem
Conventional CMOS image-sensing modules have high production costs and are bulky due to the large number of components in the lens group, making them unsuitable for small electronic devices like smartphones or pinhole cameras.
Innovation Solution
A wafer level chip scale package manufacturing method where a plurality of lens units with integrally formed lenses and edge walls are stacked and secured with glue or thermal setting, with a light-shielding film applied to the edge walls, and a cap layer with a pinhole is formed to create a compact focusing unit directly on the wafer, reducing assembly time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional lens group with multiple components is used, then the image-sensing module achieves proper light focusing, but the production cost increases and the module becomes bulky
Solution Approach 1:
The patent combines multiple lens components into a single integrated lens unit with a unified optical structure. This merging of components maintains the light focusing capability while significantly reducing the total number of parts, simplifying the overall device structure and lowering production complexity
Solution Approach 2:
The integrated lens unit performs multiple optical functions that were previously distributed across separate components. By designing a multi-functional lens structure, the patent achieves proper light focusing while reducing the component count and simplifying the assembly process
2Manufacturing precision
If a conventional lens group with multiple components is used, then the image-sensing module achieves proper light focusing, but the production cost increases
Solution Approach 1:
The patent combines multiple lens components into a single integrated lens unit with a unified optical structure. This merging of components maintains the light focusing capability while significantly reducing the total number of parts, simplifying the overall device structure and lowering production complexity
Solution Approach 2:
The lens unit is designed with a segmented structure consisting of a lens portion and an edge wall portion that are integrally formed. This segmentation allows for optimized manufacturing processes and material usage, reducing production costs while maintaining optical performance
3Manufacturing precision
If a conventional lens group with multiple components is used, then the image-sensing module achieves proper light focusing, but the assembling time increases
Solution Approach 1:
The patent combines multiple lens components into a single integrated lens unit with a unified optical structure. This merging of components maintains the light focusing capability while significantly reducing the total number of parts, simplifying the overall device structure and lowering production complexity
Solution Approach 2:
The lens and edge wall are integrally formed as a pre-assembled lens unit before being mounted onto the substrate. This preliminary integration of components reduces the number of assembly steps required during final assembly, thereby reducing assembling time and improving productivity
4Volume of moving object
If a compact focusing unit is created by stacking lens units, then the volume is reduced and productivity increases, but light shielding becomes necessary to prevent interference
Solution Approach 1:
The patent addresses light interference by adding light-shielding films to the edge walls of lens units. This converts the potential harmful effect of light leakage into a controlled feature by strategically placing shielding elements that block stray light while maintaining the compact stacked structure's optical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a cost-effective, compact image-sensing module with increased productivity by simplifying the structure and reducing the volume of the focusing unit, allowing for direct formation on the wafer and minimizing assembly time.
Implementation Method 1
a light-shielding film is formed on at least one surface of the edge walls of at least one lens unit of the plurality of lens units
Implementation Method 2
The lenses 134 focus the light rays onto a sensing area 122 of the CMOS chip 120
Data Source
AI summary
A manufacturing method of a wafer level chip scale package of an image-sensing module is provided. The method includes providing a wafer having a plurality of die regions, and a plurality of sensing units is formed on a surface of the wafer in each die region. A plurality of lens units is formed on the sensing units, wherein each lens unit includes a lens and an edge wall that are integrally formed. A light-shielding film is also formed on a surface of at least one edge wall of at least one lens units. A dicing process is then performed on the wafer to form a plurality of image sensor chips.