Wafer-Level Image Sensor Module Lens Positioning
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Solution Overview
Problem
Existing image sensor modules in portable electronic devices face challenges in achieving precise image-projection control due to manufacturing errors in lens assembly, leading to out-of-focus issues and degraded image quality, particularly in small-sized devices where mechanical adjustments are hindered by friction and multi-layer manufacturing errors.
Innovation Solution
The image sensor module employs a wafer-level structure with a stacked configuration of an image sensor chip, lens layers, and bonding layers, using spherical glass beads or other spacer elements mixed with a glue agent to accurately control lens positioning and focus images, eliminating optical errors and enabling precise image projection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a threaded adjustment mechanism is used to control lens assembly depth, then image focusing precision is improved, but friction force causes fine particles to fall and block the optical path, degrading image quality
Solution Approach 1:
The invention extracts the lens assembly from the threaded adjustment mechanism and replaces it with a fixed-position lens module. The focusing function is achieved not by mechanical adjustment but by precise control of the lens module's optical characteristics and position during manufacturing, thereby eliminating the threaded structure that generates friction and fine particles.
Solution Approach 2:
The invention replaces the mechanical threaded adjustment system with an optically-controlled system. Instead of mechanically moving the lens assembly through threading, the focusing is achieved through precise optical design and fixed positioning, substituting mechanical adjustment with optical precision.
2Measurement precision
If the threaded inside wall has sufficient height for lens assembly adjustment, then focusing control is improved, but the overall module size increases, conflicting with small-sized portable device requirements
Solution Approach 1:
The invention removes the threaded inside wall structure entirely and replaces it with a flat mounting surface. The lens module is positioned and fixed directly on this surface without requiring vertical threading space, thereby eliminating the height requirement while maintaining focusing capability through optical design.
Solution Approach 2:
The invention replaces the mechanical threaded adjustment system that requires significant vertical space with a fixed-position optical system. The focusing function is achieved through optical design rather than mechanical movement, dramatically reducing the required module height for portable devices.
3Device complexity
If multiple spacer layers and adhesive layers are stacked to control optical distance, then lens positioning is achieved, but cumulative manufacturing errors exceed 20%, making precise focusing difficult
Solution Approach 1:
The invention merges multiple separate components (spacers and adhesive layers) into a single integrated lens module structure. The lens module is manufactured as a unified component with built-in positioning features, eliminating the need for multiple stacked spacers and adhesive layers, thereby reducing cumulative manufacturing errors.
Solution Approach 2:
The invention performs preliminary positioning and focusing adjustment during the lens module manufacturing process itself. The optical distance and focusing characteristics are predetermined and built into the lens module design before assembly, eliminating the need for post-assembly adjustments and reducing the impact of manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures optimal image quality by accurately focusing projected images onto the image sensor chip, reducing manufacturing errors and accommodating the constraints of small-sized portable electronic devices.
Implementation Method 1
The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip, mixing of a glue agent and a plurality of spacer elements. The height of the spacer elements is determined to be the height of the bonding layer.
Implementation Method 2
a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip
Data Source
AI summary
An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.