Wafer-Level Microelectronic Imager Covers with Stand-offs

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Solution Overview

Problem

Conventional microelectronic imagers have large footprints and high vertical profiles, are susceptible to moisture and contaminants during assembly, and have costly and inefficient packaging processes.

Innovation Solution

The method involves attaching covers with stand-offs and windows to microelectronic imaging units at the wafer level, protecting image sensors during assembly and packaging, and using wafer-level processes to reduce costs and enhance manufacturing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional packaging with housing and interposer substrate is used, then the image sensor is protected, but the footprint and vertical profile become large

Engineering Contradiction:

Improveprotection of image sensorVSAvoidfootprint

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the cover and housing into a single integrated component. The cover serves dual functions as both the protective lid and the housing structure, eliminating the need for separate housing components and reducing overall footprint while maintaining protection of the image sensor

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent removes the interposer substrate from the packaging structure. By directly mounting the die to the circuit board and integrating the cover as the housing, the bulky interposer substrate is extracted, significantly reducing both footprint and vertical profile

Inventive Principle:

Principle #2Taking out (Extraction)

2Ease of manufacture

If die is singulated before housing and cover are placed, then assembly is simpler, but image sensor is exposed to moisture and contaminants

Engineering Contradiction:

Improveassembly processVSAvoidmoisture and contaminant exposure

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by forming the cover over the image sensor before singulation occurs. The cover is created as part of the wafer structure, establishing protection in advance before the die are separated, thus preventing exposure to contaminants during subsequent assembly steps

Inventive Principle:

Principle #10Preliminary action

3Reliability

If cover is aligned and mounted in opening with housing, then protection is provided, but packaging process becomes costly and time-consuming

Engineering Contradiction:

Improveprotection of image sensorVSAvoidpackaging efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent merges the cover and housing into a single integrated component that is formed as one piece on the wafer. This eliminates the need for separate alignment and mounting operations, allowing the entire protective structure to be created in a single efficient process step

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If conventional separate housing and cover mounting is used, then protection is achieved, but manufacturing cost increases

Engineering Contradiction:

Improveprotection of image sensorVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the cover and housing into a single integrated component formed on the wafer. This consolidation reduces the number of parts and assembly steps required, directly lowering manufacturing costs while maintaining the protective function

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent performs preliminary formation of the cover structure on the wafer before singulation. This preliminary action allows the protective structure to be created using efficient wafer-level processing rather than costly individual component fabrication and assembly

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8092734B2Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers

Publication Date: 2012.01.10 APTINA IMAGING CORP

AI summary

Methods for forming and attaching covers to microelectronic imaging units, packaging microelectronic imagers at the wafer level, and microelectronic imagers having covers that protect the image sensor are disclosed herein. In one embodiment, a method includes providing a first substrate having a plurality of covers, the covers including windows comprising regions of the first substrate and stand-offs projecting from the windows. The method continues by providing a second substrate having a plurality of microelectronic dies with image sensors, integrated circuits electrically coupled to the image sensors, and terminals electrically coupled to the integrated circuits. The method includes assembling the covers with corresponding dies so that the windows are aligned with corresponding image sensors and stand-offs contact corresponding dies inboard of the terminals and outboard of the image sensors. The first substrate is then cut to singulate the individual covers, after which the second substrate is cut to singulate individual imaging units.