Wafer Level Laser Marking Using Support Tape
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Solution Overview
Problem
Ultra-thin integrated circuit wafers are prone to warpage, which complicates the accurate placement of identifying marks, and existing solutions either limit integrated circuit size or yield, or fail to provide clear markings due to warpage variations.
Innovation Solution
A wafer level marking system that uses a support tape with structural integrity to resist warpage, allowing for accurate and clear marking of the wafer through a laser marking system without compromising the wafer's integrity or limiting integrated circuit size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If additional physical structures are added to the wafer to alleviate warpage, then warpage is reduced, but integrated circuit size and yield are limited
Solution Approach 1:
A support tape is introduced as an intermediary element between the wafer and the marking system. The support tape provides the necessary mechanical support to reduce warpage during the marking process, while not being permanently attached to the wafer, thus avoiding limitations on integrated circuit size and yield.
Solution Approach 2:
The support structure is segmented into a removable support tape rather than being integrated as a permanent structure on the wafer. This allows the support function to be provided during marking while not interfering with the integrated circuit fabrication and yield.
2Ease of manufacture
If conventional marking methods are used on warped wafers, then marking can be performed, but identifying marks are not clear or accurate
Solution Approach 1:
The support tape is applied to the wafer before the marking process to pre-establish a stable, flat surface. This preliminary action ensures that when the laser marking occurs, the wafer is in a stable state, enabling accurate and clear identifying marks to be placed.
3Length of moving object
If the wafer is made thinner to reduce size, then integrated circuit density increases, but warpage and marking difficulties increase
Solution Approach 1:
The support tape serves as a temporary intermediary that compensates for the inherent instability of ultra-thin wafers during the marking process, enabling the use of thinner wafers without sacrificing marking quality or wafer stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively minimizes warpage and ensures reliable, readable identifying marks on ultra-thin wafers, improving yield and handling during manufacturing and integration, while being cost-effective and adaptable to various wafer sizes and technologies.
Implementation Method 1
marking the wafer through the support tape
Implementation Method 2
marking the wafer through the support tape
Data Source
AI summary
A wafer level marking system is provided including: providing a wafer, a wafer frame, and a support tape; mounting the wafer and the wafer frame on the support tape; and marking the wafer through the support tape.