Wafer-Level LED Packaging for Tighter Die Packing
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Solution Overview
Problem
Conventional LED manufacturing processes involve redundant steps and high costs due to the handling and packaging of discrete LED dies, which limits efficiency and increases manufacturing expenses.
Innovation Solution
The method involves wafer-level packaging, where LED wafers are joined with carrier wafers, shaped, and wavelength conversion materials are applied, followed by singulation to produce LED dies that are directly mounted on light fixture boards, eliminating the need for separate packaging and module factories.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional discrete LED die handling and packaging processes are used, then LED manufacturing can be performed with traditional methods, but manufacturing costs increase and efficiency decreases due to redundant steps
Solution Approach 1:
The patent merges LED die mounting and wavelength conversion material application into a single wafer-level processing step. Multiple LED dies are mounted on a carrier wafer in array formation, and wavelength conversion material is applied to the entire array simultaneously, eliminating the need for separate discrete handling and packaging steps for each LED die.
Solution Approach 2:
The patent performs preliminary mounting of multiple LED dies on a carrier wafer in their final array configuration before applying wavelength conversion material. This preliminary arrangement allows subsequent processing steps to be performed on the complete LED array rather than on individual dies, improving manufacturing efficiency.
2Ease of manufacture
If separate packaging and module factories are used, then specialized manufacturing can be performed, but manufacturing costs increase
Solution Approach 1:
The patent combines packaging operations and module assembly operations into a single integrated wafer-level process. LED dies are mounted on a carrier wafer, wavelength conversion material is applied, and the complete LED array is processed together, eliminating the need for separate packaging and module assembly facilities.
Solution Approach 2:
The carrier wafer serves multiple functions: it acts as a mounting substrate for LED dies, a platform for simultaneous wavelength conversion material application, and a structure that maintains LED array configuration throughout processing. This multi-functionality eliminates the need for multiple specialized manufacturing steps and facilities.
3Illumination intensity
If LED dies are packed with larger spacing, then easier handling is achieved, but light output per unit area decreases
Solution Approach 1:
The patent segments the handling process from the final product configuration. LED dies are handled in array formation on a carrier wafer with uniform spacing, allowing easy wafer-level processing. The carrier wafer acts as a handling unit that maintains precise LED die spacing, enabling tight packing in the final product while preserving ease of handling during manufacturing.
Solution Approach 2:
The carrier wafer serves as an intermediary structure that facilitates handling of tightly packed LED dies. It provides a rigid platform that maintains precise spacing between LED dies during manufacturing processes, allowing tight packing for high luminous efficiency while enabling easy wafer-level handling and processing.
Data Source
AI summary
An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.