Wafer-Level LED Assembly for Tight Wavelength Control
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Solution Overview
Problem
Conventional methods for manufacturing light emitting diode (LED) assemblies are cost and labor intensive due to the need for downstream processing of individual LEDs, which lacks efficiency and control over wavelength output.
Innovation Solution
The development of wafer level LED assemblies where multiple LEDs are processed together, using a common wafer with adhesive and optically transparent lenses to form a rigid structure, allowing for efficient downstream processing and precise control over light emission wavelengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional methods process individual LEDs separately through downstream manufacturing steps, then each LED can be individually processed and assembled, but the manufacturing process becomes cost and labor intensive with reduced efficiency
Solution Approach 1:
The patent merges multiple individual LED processing steps into a single wafer-level operation. Multiple LEDs remain on the wafer substrate throughout downstream manufacturing steps including wavelength conversion material deposition and lens formation, eliminating the need to handle and process each LED separately. This combining of operations at the wafer level directly improves productivity while reducing manufacturing complexity.
Solution Approach 2:
The patent transitions from processing LEDs in isolation (zero-dimensional individual handling) to processing multiple LEDs simultaneously on a two-dimensional wafer plane. This dimensional shift enables parallel processing of multiple LEDs through downstream steps, dramatically improving manufacturing efficiency without requiring proportionally increased labor or complexity.
2Manufacturing precision
If conventional methods use diced individual LEDs for downstream processing, then each LED can be independently assembled into packages, but the process requires significant labor and cost with loose control over wavelength output
Solution Approach 1:
The patent performs wavelength conversion material deposition and lens formation while LEDs are still on the wafer, before dicing into individual LEDs. This preliminary action ensures uniform wavelength conversion properties across all LEDs in the array, providing tight wavelength control. The wavelength conversion layer is applied to the entire wafer surface, ensuring consistent optical properties that would be difficult to achieve through individual LED processing.
3Productivity
If multiple LEDs are processed individually through downstream manufacturing, then each LED can be independently configured, but the manufacturing process becomes labor intensive and costly
Solution Approach 1:
The patent maintains continuous processing of multiple LEDs through downstream manufacturing steps without interruption or individual handling. The wafer-level approach allows wavelength conversion material deposition, lens formation, and other downstream steps to proceed continuously across the entire wafer surface, maximizing processing throughput and eliminating idle time associated with individual LED handling and setup.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency and control over light emission properties, such as white point, by enabling simultaneous processing of multiple LEDs, reducing costs and maintaining tight wavelength control.
Implementation Method 1
A lens is disposed over the light emitting diode, wherein the lens is formed from an optically transparent material that encapsulates top and side surfaces of the light emitting diode
Implementation Method 2
obtain a desired degree of control over the wavelength of light emitted, i.e., white point control from the LEDs
Data Source
AI summary
Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs.