Wafer Level Lens Alignment via Carrier Film and Extraction
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Solution Overview
Problem
The existing wafer-level lens manufacturing techniques face challenges in achieving satisfactory image quality due to alignment issues between lens films on different transparent substrates, leading to impaired optical properties.
Innovation Solution
A method of manufacturing a lens sheet that includes a first transparent substrate with a first lens film, a second transparent substrate with a second lens film, and a third lens film formed on the second substrate, along with buffer cavities and bonding material patterns, which allows for alignment inspection and compensation to ensure optimal optical properties, and prevents contamination of lens portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple transparent substrates with lens films are attached to improve image quality, then the optical property is improved, but the alignment between lens films becomes difficult and optical property deteriorates
Solution Approach 1:
A carrier film is introduced as an intermediary component between the first and second lens films. The first lens film is attached to the carrier film, and the carrier film with the first lens film is then attached to the second lens film on the second transparent substrate. This intermediary carrier film facilitates precise alignment and attachment while maintaining optical performance, resolving the contradiction between improved image quality and alignment difficulty.
2Strength
If bonding material is applied to attach lens films, then the attachment strength is improved, but the bonding material may contaminate the lens portions and optical property deteriorates
Solution Approach 1:
The harmful bonding material is extracted or removed from the lens portions before attachment. The method includes removing the bonding material from the lens portions after attachment, ensuring that no contamination remains on the optical surfaces. This resolves the contradiction by maintaining strong attachment while eliminating contamination risks.
Solution Approach 2:
The lens films are aligned and positioned on the carrier film before applying bonding material. This preliminary alignment ensures that bonding material is applied only in non-critical areas, preventing contamination of optical surfaces while maintaining attachment strength.
3Measurement precision
If alignment inspection is performed to ensure optical property, then the measurement precision is improved, but the manufacturing time increases
Solution Approach 1:
Alignment inspection is performed at an intermediate stage during the multi-step attachment process, before final assembly. This preliminary inspection allows for early detection and correction of alignment issues, reducing the need for time-consuming rework later while maintaining high measurement precision.
Solution Approach 2:
The carrier film provides self-aligning features or markers that facilitate quick and accurate alignment inspection. The structured design of the carrier film enables automated inspection systems to rapidly verify alignment without requiring complex manual measurement procedures, thus maintaining high precision while minimizing time loss.
Data Source
AI summary
A method of manufacturing a lens sheet including following steps is provided. A first structure is provided. The first structure includes a first transparent substrate and a first lens film attached to the first transparent substrate. A second structure is provided. The second structure includes a second transparent substrate and a second lens film. The second transparent substrate has a first surface and a second surface opposite to the first surface. The second lens film is attached to the first surface. The first lens film is attached to the second lens film. A third lens film is formed on the second surface of the second substrate after the first lens film is attached to the second lens film. Moreover, a lens sheet and a wafer level lens are also provided.


