Wafer-Level Lens Systems with Aspheric Elements
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Solution Overview
Problem
Conventional camera modules with plastic lenses face limitations in achieving high light collection efficiency and optimal imaging performance due to their fixed material composition and manufacturing methods, which restricts the ability to minimize optical aberrations and meet cost and performance demands.
Innovation Solution
The implementation of a wafer-level lens system using multiple lenses with different materials and aspheric surfaces, optically coupled in series, which allows for improved optical design and manufacturing flexibility through wafer-level manufacturing methods, enabling better aberration correction and compatibility with reflow soldering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional plastic lenses with fixed material composition are used, then manufacturing cost is reduced and mass production is enabled, but optical performance is limited and aberration correction is insufficient
Solution Approach 1:
The patent applies composite materials by combining multiple lens elements made from different materials (e.g., glass and plastic, or different types of glass) within a single lens system. This allows the system to achieve superior optical performance and aberration correction while maintaining compatibility with cost-effective manufacturing processes through wafer-level fabrication techniques.
Solution Approach 2:
The patent segments the lens system into multiple discrete lens elements that can be individually optimized for specific optical functions. Each lens element can be designed with specific material properties and surface characteristics to correct particular types of aberrations, while the entire system remains manufacturable through standardized wafer-level processes.
2Manufacturing precision
If multiple lens elements with different materials are used, then aberration correction is improved and optical performance is enhanced, but device complexity increases
Solution Approach 1:
The patent merges multiple lens elements into a compact integrated lens system where elements are closely spaced and optically coupled. This integration reduces the overall physical footprint and simplifies the mechanical structure while maintaining the optical benefits of multiple different materials for aberration correction.
Solution Approach 2:
The patent utilizes the wafer-level manufacturing dimension to create lenses with complex three-dimensional surface profiles (including aspheric surfaces) that can be fabricated in a single processing step. This adds optical design freedom without proportionally increasing manufacturing complexity, as the complex surfaces are created through deposition and etching processes rather than mechanical machining.
3Productivity
If wafer-level manufacturing methods are used, then mass production capability and cost-effectiveness are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates preliminary alignment features directly into the wafer fabrication process, such as alignment marks, registration structures, and pre-positioned mounting features. These are created during the semiconductor manufacturing steps before the lens elements are finalized, ensuring precise alignment is built-in from the outset rather than requiring post-fabrication adjustment.
Solution Approach 2:
The patent replaces traditional mechanical alignment and adjustment mechanisms with optical and material-based alignment methods. For example, optical alignment marks visible through transparent layers, thermal expansion matching between substrates and lens elements, and stress-induced alignment through controlled cooling or heating processes enable precise positioning without mechanical intervention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the optical performance of camera modules by reducing aberrations and maintaining identical optical properties before and after reflow soldering, resulting in improved image quality and cost-effective mass production.
Implementation Method 1
a wafer-level lens system for imaging a scene onto an image plane includes one or more wafer-level lenses, each of the one or more wafer-level lenses having (a) a substrate with opposing first and second surfaces, (b) a first lens element of a first material and disposed on the first surface, and (c) a second lens element of a second material and disposed on the second surface
Data Source
AI summary
A wafer-level lens system includes one or more wafer-level lenses, each of the one or more wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element of a first material and disposed on the first surface, and a second lens element of a second material and disposed on the second surface, wherein, for at least one of the one or more wafer-level lenses, the first material is different from the second material. Another wafer-level lens system includes three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface.