Wafer-Level Lens System for Ultra-Compact Camera Modules
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Solution Overview
Problem
Conventional medical endoscope camera systems face challenges in achieving high optical performance within tight spatial constraints, limiting their effectiveness in applications like medical diagnostics and procedures due to the size constraints imposed by the need to fit within small body cavities and navigate narrow passageways.
Innovation Solution
The development of ultra-small camera modules with a wide field of view, incorporating wafer-level lens systems and manufacturing methods that allow for compact, high-performance imaging, including a distal planar surface and optically coupled lens elements with curved surfaces, and an image sensor with a rectangular array of photosensitive pixels, all mechanically coupled to minimize size while maintaining optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lens systems are used to achieve high optical performance, then imaging quality is improved, but the size of the camera system increases beyond acceptable limits for medical endoscope applications
Solution Approach 1:
The patent transitions from conventional individual lens assembly to a wafer-level integrated lens system where multiple lens elements are arranged in a planar wafer configuration. This dimensional reorganization allows complex optical paths to be achieved within a compact footprint, resolving the contradiction between optical performance and system size.
Solution Approach 2:
Multiple lens elements are merged into a single integrated wafer structure with curvilinear surfaces formed on a common substrate. This consolidation eliminates the need for separate mounting and alignment of individual lenses, achieving high optical performance while minimizing the overall camera module size to fit within 1.5mm cross-sectional constraints.
2Volume of moving object
If the camera system size is reduced to fit within narrow body passageways, then spatial constraints are satisfied, but optical performance deteriorates
Solution Approach 1:
The patent employs curvilinear lens surfaces formed directly on the wafer substrate, replacing conventional flat or simple spherical surfaces. These optimized curved surfaces enable high-quality wide-FOV imaging within the constrained 1.5mm cross-sectional envelope, maintaining optical performance despite the reduced system size.
Solution Approach 2:
The invention changes the fundamental geometric parameters of the lens system by forming continuous curvilinear surfaces with specific radius of curvature profiles on the wafer. This parameter optimization allows the compact wafer-level lens to achieve diffraction-limited performance across a wide field of view while maintaining the ultra-small form factor required for endoscope applications.
3Adaptability or versatility
If a wide field of view is achieved through conventional lens designs, then FOV is improved, but the lens system becomes too complex and large for ultra-compact camera modules
Solution Approach 1:
The wafer-level lens system segments the optical function into multiple curvilinear surfaces on a single wafer, with each surface contributing to specific aspects of light control. This segmentation allows the wide-FOV requirement to be met through distributed optical power across the curvilinear surfaces rather than requiring a complex multi-element conventional lens assembly.
Solution Approach 2:
The integrated wafer-level lens structure performs multiple optical functions simultaneously through its curvilinear surfaces, including wide-FOV imaging, aberration correction, and focus control. This multi-functionality within a single wafer element achieves wide field of view without the complexity of separate optical components, maintaining compatibility with ultra-compact camera module constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These ultra-small camera modules achieve a wide field of view with a compact size, suitable for medical endoscopes and other applications, enhancing diagnostic capabilities and operational efficiency by reducing the spatial requirements and improving imaging performance.
Implementation Method 1
The wafer-level lens system includes a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface
Implementation Method 2
The image sensor includes a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image
Data Source
AI summary
An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.