Compact Wafer-Level Lens System for Endoscope Imaging
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Solution Overview
Problem
Medical endoscope camera systems face challenges in achieving high optical performance due to spatial constraints, limiting their effectiveness in diagnostic and procedural applications.
Innovation Solution
A compact three-surface wafer-level lens system is developed, comprising a first and second wafer-level lens, optimized for low total track length and maximum transverse extent, enabling a wide field of view while maintaining high optical performance, and manufactured using wafer-level processes compatible with reflow soldering for cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lens systems are used to achieve high optical performance, then optical quality is improved, but the total track length and transverse extent increase beyond acceptable limits for medical endoscopes
Solution Approach 1:
The lens system is divided into multiple wafer-level lens elements (first wafer-level lens and second wafer-level lens) that are disposed in series between the scene and image plane. Each lens element contributes to the overall optical performance while maintaining a compact individual footprint, enabling high optical quality within a constrained total track length of no more than 2.2 millimeters.
Solution Approach 2:
The patent transitions from conventional bulk lens manufacturing to wafer-level lens fabrication, utilizing thin-film deposition and microfabrication techniques to create lens elements with precise optical properties in a planar format. This dimensional approach enables complex optical performance in a dramatically reduced thickness profile.
2Manufacturing precision
If conventional lens systems are used to achieve high optical performance, then optical quality is improved, but the transverse extent exceeds the 1.8 millimeter constraint for medical endoscope applications
Solution Approach 1:
The optical system is segmented into multiple thin wafer-level lens elements rather than using a single bulky lens. This segmentation allows the light path to be folded and optimized, achieving wide field of view (at least 100 degrees) and high optical performance while constraining the maximum transverse extent to no greater than 1.8 millimeters.
Solution Approach 2:
The patent employs wafer-level fabrication parameters including thin-film material deposition, precise thickness control, and micro-scale lens curvature optimization to achieve high optical performance in a compact transverse footprint. The lens elements are designed with specific focal lengths and surface curvatures optimized for the constrained geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compact lens system achieves high optical performance with a wide field of view in a small package, suitable for medical endoscopes, and simplifies camera module manufacturing, addressing spatial constraints and cost considerations.
Implementation Method 1
a first lens element formed on the second planar surface and having a first lens surface facing the image plane... a second lens element bonded to the third planar surface forming a second lens surface facing the scene, and a third lens element bonded to the fourth planar surface forming a third lens surface facing the image plane
Data Source
AI summary
A compact three-surface wafer-level lens system for imaging a scene onto an image plane includes a one-sided wafer-level lens and a two-sided wafer-level lens disposed between the one-sided wafer-level lens and the image plane. The total track length of the wafer-level lens system is no more than 2.2 millimeters. The maximum transverse extent (in dimensions transverse to the optical axis) of the lens system and associated light propagating therethrough is no greater than 1.8 millimeters. The field of view angle of the lens system is at least 100 degrees.