Wafer-Level Optical Lens Layout for Low-Cost Aberration Correction
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Solution Overview
Problem
Existing small optical systems for medical endoscopes and similar applications are costly due to the wafer level process, which involves multiple substrates and bonding, compromising the balance of optical performance and cost.
Innovation Solution
A wafer level lens system is designed with a configuration of first, second, and third units, each manufactured using a curable resin material on a glass substrate, integrated to form a compact optical system with a diaphragm, optimizing refractive powers and aberration correction while reducing material and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a wafer level process with multiple substrates and bonding is used to manufacture small optical systems, then the optical system size is reduced, but the manufacturing cost increases
Solution Approach 1:
The patent merges multiple lens elements and substrates into a single integrated lens substrate. Instead of using separate substrates bonded together, all lens elements are formed on one substrate using wafer-level processing techniques, eliminating the need for complex bonding processes and reducing manufacturing cost while maintaining compact size
Solution Approach 2:
The single lens substrate performs multiple functions that would traditionally require separate components. It integrates multiple lens elements, support structures, and optical functions into one universal component, simplifying the manufacturing process and reducing the number of assembly steps required
2Manufacturing precision
If multiple substrates and bonding processes are used in wafer level manufacturing, then lens elements can be precisely positioned, but the manufacturing complexity increases
Solution Approach 1:
The patent combines multiple positioning and support functions into the single lens substrate. By forming all lens elements directly on one substrate using wafer-level processing, the need for multiple bonding steps and complex alignment procedures is eliminated, reducing manufacturing complexity while maintaining precise positioning through integrated design
Solution Approach 2:
The lens elements are pre-formed and positioned on the substrate during the wafer-level manufacturing process itself, before final assembly. This preliminary formation and positioning of all lens elements on a single substrate eliminates the need for complex post-assembly alignment and bonding operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a small, inexpensive optical system with high optical performance by correcting various aberrations and maintaining a balance in refractive powers, thus achieving a cost-effective and efficient imaging solution suitable for medical endoscopes and electronic devices.
Implementation Method 1
A wafer level lens system is designed with a configuration of first, second, and third units, each manufactured using a curable resin material on a glass substrate, integrated to form a compact optical system with a diaphragm, optimizing refractive powers and aberration correction
Data Source
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AI summary
An optical system includes, in order from an object side to an image side, a first unit, a second unit, and a third unit. The first unit includes a first substrate, and a first lens having a negative refractive power and disposed on the image side of the first substrate. The second unit includes a second substrate, and a second lens having a positive refractive power and disposed on the object side of the second substrate. The third unit includes a third substrate, and a third lens having a positive refractive power and disposed on the object side of the third substrate.