Wafer-Level Lens Module for Accurate Depth Calculation
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Solution Overview
Problem
Current scene-detection systems face inaccuracies in determining the distance between optical elements due to imprecise positioning methods like surface-mount technology, necessitating additional error detection and correction processes for depth calculation.
Innovation Solution
The integration of wafer level lens groups during fabrication ensures precise distance determination, eliminating the need for additional error detection processes by forming the lens groups with parallel optical axes and sensors, allowing for accurate depth calculation without corrective measures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If surface-mount technology is used to position optical elements, then the assembly process is simple, but the distance between optical elements cannot be controlled accurately
Solution Approach 1:
The patent merges the lens groups and sensors into a single integrated wafer-level structure. Multiple lens groups and sensors are fabricated together on the same substrate using semiconductor manufacturing processes, eliminating the need for separate surface-mount positioning. This integration ensures that the distance between optical elements is precisely controlled by the fabrication process rather than by mechanical assembly, directly resolving the contradiction between assembly simplicity and distance control accuracy.
Solution Approach 2:
The patent replaces the mechanical surface-mount positioning system with a wafer-level fabrication system. Instead of mechanically mounting lens groups and sensors separately and then measuring/adjusting distances, the invention uses semiconductor fabrication processes to create the optical elements and their relative positions in a single integrated process. This substitution of mechanical assembly with semiconductor manufacturing inherently provides precise distance control while maintaining ease of production through standardized fabrication techniques.
2Measurement precision
If additional error detection process is performed, then the depth calculation accuracy is improved, but the device complexity and production time increase
Solution Approach 1:
The patent performs the distance determination action during the wafer-level fabrication process itself, before the components are assembled into the final device. By establishing the precise distances between optical elements during fabrication rather than during final assembly or testing, the invention eliminates the need for subsequent error detection processes. This preliminary action ensures depth calculation accuracy while avoiding the added complexity of additional detection steps.
3Manufacturing precision
If wafer level fabrication is used, then the distance between lens groups is determined accurately, but the fabrication process complexity increases
Solution Approach 1:
The patent applies wafer-level fabrication techniques that are originally designed for semiconductor devices to optical component manufacturing. This universal approach uses the same precise control and integration methods already established in the semiconductor industry, so while the process is more complex than traditional optical assembly, it leverages existing multi-functional fabrication capabilities to achieve superior distance determination accuracy.
Data Source
AI summary
A lens module includes a first wafer level lens group, a second wafer level lens group, a first sensor, and a second sensor. The first wafer level lens group has a first optical axis. The second wafer level lens group has a second optical axis. The first optical axis is parallel with the second optical axis, and the first wafer level lens group and the second wafer level lens group are integrally formed. The first sensor is disposed corresponding to the first wafer level lens group, and the first sensor is disposed on the first optical axis. The second sensor is disposed corresponding to the second wafer level lens group, and the second sensor is disposed on the second optical axis.