Wafer-Level Lens Module Extended Depth of Field

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Solution Overview

Problem

Wafer-level lens modules for mobile devices face challenges in achieving extended depth of field (EDF) with consistent picture quality across different wavelengths and distances, leading to picture quality deterioration in macro-focus mode due to structural limitations such as short focal distances and high manufacturing costs associated with voice coil motors.

Innovation Solution

A wafer-level lens module design featuring a plurality of wafer-scale lenses with optimized aspheric profiles, including a center region optimized for infinity-focused images and an edge region optimized for macro-focused images, using a corrected aspheric function with specific error corrections to maintain image quality across varying distances and wavelengths without additional elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a voice coil motor (VCM) is added to provide auto-focus and macro-focus capabilities, then focusing capabilities are improved, but manufacturing costs increase and device size increases

Engineering Contradiction:
Improvefocusing capabilitiesVSAvoiddevice size
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical VCM focusing system with an optical solution using multiple wafer-scale lenses with specific aspheric profiles. The lens structure itself provides the focusing capabilities through its optical design, eliminating the need for mechanical movement components.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent combines multiple wafer-scale lenses into a single integrated module where the collective optical properties provide both auto-focus and macro-focus capabilities. The multiple lenses work together to extend the depth of field and provide various focusing ranges without separate mechanical systems.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If a VCM is added to provide auto-focus capabilities, then focusing capabilities are improved, but manufacturing costs increase

Engineering Contradiction:
Improveauto-focus capabilitiesVSAvoidmanufacturing costs
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent eliminates the mechanical VCM system and replaces it with a purely optical solution using multiple wafer-scale lenses. This substitution reduces manufacturing complexity and cost while maintaining auto-focus functionality through the lens design itself.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The multiple wafer-scale lenses in the module serve multiple functions simultaneously: they provide image formation, extended depth of field, auto-focus capability, and macro-focus capability. This multi-functionality eliminates the need for separate dedicated components for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If the focal distance is shortened to enable macro-focus mode, then close-up imaging capability is improved, but picture quality deteriorates

Engineering Contradiction:
Improvemacro-focus capabilityVSAvoidpicture quality
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies different aspheric profile characteristics to different regions of the lens module. Each wafer-scale lens is designed with specific aspheric coefficients that optimize performance for particular focal distances, allowing the center region to handle infinity focus while the edge region optimizes for macro focus.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses a composite optical structure with multiple wafer-scale lenses, each contributing specific optical properties. The combination of these lenses creates a system that maintains picture quality across varying focal distances by leveraging the complementary characteristics of each lens element.

Inventive Principle:
Principle #40Composite materials

4Adaptability or versatility

If multiple wafer-scale lenses are stacked to achieve extended depth of field, then depth of field is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveextended depth of fieldVSAvoidlens stacking structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent divides the optical system into multiple discrete wafer-scale lenses, each manufactured independently and then stacked together. This segmentation allows for simplified manufacturing of individual lens elements while achieving complex optical performance through the assembly of multiple standardized components.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables excellent picture quality regardless of incident light wavelength or object distance, reduces manufacturing costs by eliminating the need for additional elements, and simplifies mold manufacturing by using only one surface correction, thereby enhancing the EDF lens module's performance and cost-effectiveness.

Implementation Method 1

A wafer-level lens module includes a plurality of wafer-scale lenses stacked with fixed distances therebetween

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS8305699B2Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module
Publication Date: 2012.11.06 SAMSUNG ELECTRONICS CO LTD
  • US8305699B2 patent drawing
  • US8305699B2 patent drawing
  • US8305699B2 patent drawing

AI summary

A wafer-level lens module with an extended depth of field (EDF) and an imaging device including the wafer-level lens module are provided. The wafer-level EDF lens module includes a plurality of wafer-scale lenses stacked with fixed distances therebetween. The plurality of wafer-scale lenses includes an effective lens having a profile which satisfies a corrected optimized aspheric function, wherein a profile of a center region of the effective lens is optimized for an infinity-focused image and a profile of an edge region of the effective lens is optimized for a macro-focused image.