Wafer Level Lens in Package for Gesture Sensing
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Solution Overview
Problem
Light sensing devices, such as gesture sensing devices, face challenges with increased size, reliability, and optics quality due to the addition of components, which affect their performance in detecting light and physical movements.
Innovation Solution
A wafer level optical device system that includes a substrate with an electronic device, an illumination source, an enclosure with optical surfaces and lenses, and solder balls for electrical connection, forming compartments to enhance detection capabilities while minimizing size and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components (electronic device, illumination source, enclosure) are added to light sensing devices, then detection capabilities are enhanced, but device size and footprint increase
Solution Approach 1:
The patent merges the electronic device and illumination source onto a single substrate, integrating multiple functional components into one compact platform. This consolidation reduces the overall device footprint while maintaining all necessary detection capabilities through shared structural support and optimized component placement.
Solution Approach 2:
The enclosure is designed to cover and protect the substrate-mounted components, creating a nested structure where the substrate contains the electronic device and illumination source, while the enclosure provides additional protection and optical functionality. This nested arrangement maximizes space utilization and minimizes the external footprint.
2Adaptability or versatility
If multiple components are added to light sensing devices, then detection capabilities are enhanced, but reliability decreases
Solution Approach 1:
By merging the electronic device and illumination source onto a single substrate with integrated mounting, the patent reduces the number of inter-component connections and interfaces. This integration minimizes potential failure points associated with multiple separate components and their interconnections, thereby enhancing overall system reliability while preserving detection capabilities.
Solution Approach 2:
The enclosure serves as a protective structure that shields the substrate-mounted components from environmental stressors and physical damage before failures can occur. This protective design approach pre-empts reliability issues by providing mechanical protection and controlled optical environments for the sensitive detection components.
3Adaptability or versatility
If multiple components are added to light sensing devices, then detection capabilities are enhanced, but optics quality deteriorates
Solution Approach 1:
The integration of the illumination source and electronic device on a common substrate enables precise relative positioning and alignment between optical components. This merged structure facilitates controlled optical path management and reduces misalignment errors, thereby maintaining high optics quality while enhancing detection versatility through multiple functional elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces the size and footprint of light sensing devices while maintaining high reliability and optics quality, enabling efficient detection of light and physical movements, and can be applied to various sensing applications beyond gesture sensing.
Implementation Method 1
an enclosure with optical surfaces and lenses
Implementation Method 2
photodetectors such as photodiodes, phototransistors, or the like, which convert received light into an electrical signal
Data Source
AI summary
A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.