Wafer-Level Lens Packaging for Array Camera Alignment
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Solution Overview
Problem
The high manufacturing cost of camera modules, particularly due to costly packaging processes in array cameras where each lens must be aligned with its image sensor and the housing must be light-tight to prevent external light interference and cross-talk, is a significant challenge.
Innovation Solution
A method for packaging wafer-level lenses involves partially encasing them with a housing material to form a wafer of packaged lenses, where the housing material supports each lens and is shaped to form light-tight housings with openings for light propagation, simplifying alignment and assembly with image sensors, reducing the number of bonding steps, and eliminating the need for separate light-blocking coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional packaging processes are used for array cameras with individual alignment and light-tight housing construction, then each lens can be precisely aligned with its image sensor, but the manufacturing cost increases significantly
Solution Approach 1:
The patent merges multiple packaging operations into a single integrated wafer-level packaging process. Multiple lenses and their corresponding image sensors are aligned and packaged simultaneously on the wafer substrate, eliminating the need for individual alignment and separate housing construction for each lens-sensor pair. This combining of operations maintains precision while dramatically reducing manufacturing cost and complexity.
Solution Approach 2:
The wafer-level packaging structure serves multiple functions simultaneously: it provides mechanical support for multiple lenses and sensors, ensures precise alignment through the wafer substrate, creates light-tight enclosures, and enables mass production. This multi-functional design eliminates the need for separate components and processes for each function, resolving the contradiction between precision and manufacturing ease.
2Object-affected harmful factors
If individual light-tight housings are constructed for each camera in the array, then cross-talk between cameras is prevented, but the packaging complexity and cost increase
Solution Approach 1:
The patent combines multiple individual housing functions into a single integrated wafer-level structure. The wafer substrate itself forms the common light-tight enclosure for multiple cameras, with individual lens openings and internal partitions preventing cross-talk. This merging eliminates the need for separate housing construction for each camera while maintaining light-tightness and preventing interference.
Solution Approach 2:
While merging the overall housing structure, the patent segments the wafer-level housing into individual camera compartments through internal partitions and separate lens openings. Each camera has its own optical path isolated from others, preventing cross-talk while sharing the common wafer substrate and housing structure. This segmentation within integration resolves the complexity issue.
3Manufacturing precision
If multiple bonding steps are used for aligning lenses with image sensors, then precise alignment is achieved, but the manufacturing time and cost increase
Solution Approach 1:
The patent performs alignment准备工作 in advance at the wafer level before final assembly. Lenses and image sensors are pre-aligned on the wafer substrate using the wafer's inherent flatness and positioning features. This preliminary alignment eliminates the need for multiple time-consuming bonding and realignment steps during final assembly, maintaining precision while dramatically improving productivity.
Solution Approach 2:
Multiple alignment and bonding operations that would normally be performed sequentially on individual components are merged into a single wafer-level bonding process. All lenses and sensors are aligned and bonded to the wafer substrate simultaneously in one operation, rather than through multiple separate steps, thereby increasing assembly speed while maintaining alignment precision.
Data Source
AI summary
A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.