Wafer Level Lens VCSEL Module for Compact 3D Imaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional structure light modules using VCSEL arrays are large in size due to the use of barrels and thick lenses, which cannot be disposed close to the VCSEL array due to heat issues and de-centering problems.
Innovation Solution
The use of wafer level lenses and spacers stacked directly on the VCSEL array, eliminating the need for barrels and lens holders, with a diffractive optical element (DOE) generating a far field diffraction pattern for 3D imaging, and optional heat insulation glass to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional barrels and thick lenses are used in structure light module, then the lens can focus light effectively, but the module size becomes large and heat management becomes difficult
Solution Approach 1:
The patent changes the physical parameters of the lens by transitioning from conventional thick lenses to thin wafer-level lenses. This parameter change enables the lens to be positioned close to the VCSEL array while maintaining focusing capability, thereby reducing module size and improving heat management without sacrificing optical performance
Solution Approach 2:
The patent adopts a wafer-level lens structure that transitions from traditional three-dimensional thick lens geometry to a two-dimensional thin wafer structure. This dimensional change allows the lens to achieve effective focusing with minimal thickness, enabling close placement to the heat-generating VCSEL array and significantly reducing overall module volume
2Manufacturing precision
If thick lenses are used, then light focusing is effective, but the lens cannot be disposed close to the VCSEL array causing de-centering problems
Solution Approach 1:
The patent changes the thickness parameter of the lens from conventional thick dimensions to thin wafer-level dimensions. This parameter change enables the lens to be positioned immediately adjacent to the VCSEL array, eliminating de-centering problems while maintaining effective light focusing capability through optimized wafer-level optical design
3Power
If VCSEL array operates at high power, then structure light intensity is sufficient for 3D imaging, but heat generation causes overheating issues
Solution Approach 1:
The patent introduces heat insulation glass as an intermediary component between the VCSEL array and the external environment. This intermediary element allows the VCSEL array to operate at high power for sufficient light intensity while the heat insulation glass manages the generated heat, preventing overheating and enabling sustained high-performance operation
Solution Approach 2:
The patent converts the harmful heat generated by high-power VCSEL operation into a manageable thermal field by implementing heat insulation glass. This transforms the heat problem into a controlled thermal management scenario, allowing the system to maintain high light intensity for effective 3D imaging while preventing overheating through structured heat insulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a compact structure light module with improved heat management and precise alignment, enabling smaller size and effective 3D imaging without the need for large baselines or advanced processors.
Implementation Method 1
A VCSEL array comprises a plurality of individual VCSELs. Each individual VCSEL emits an individual laser beam
Implementation Method 2
A wafer level lens is disposed on the VCSEL array. Each individual laser beam emitted by the VCSEL array is collimated by the wafer level lens to form a collimated beam
Implementation Method 3
A diffractive optical element (DOE) generates a far field diffraction pattern
Data Source
AI summary
A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a second spacer disposes on the wafer level lens; a DOE disposed on the second spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.