Wafer-Level Parallel Memory Programming for Secure Personalization

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Solution Overview

Problem

Conventional methods for programming memory devices on wafers are time-consuming and inefficient, as each memory component must be individually connected and programmed after being cut from the wafer, leading to increased manufacturing costs and reduced productivity.

Innovation Solution

A wafer program component that facilitates parallel programming of content onto multiple memory devices still on the wafer, allowing for simultaneous or near-simultaneous programming of operating systems, applications, and personalized data, including secure content that can only be accessed with authentication information, based on the type of electronic device and user characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If memory devices are programmed individually after being cut from the wafer, then each memory component can be programmed with content, but the manufacturing process becomes time-consuming and productivity decreases

Engineering Contradiction:

Improveprogramming efficiencyVSAvoidmanufacturing time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The patent applies preliminary action by programming memory devices while they are still mounted on the wafer before the wafer is cut into individual dies. This allows the programming operation to be performed in advance during the fabrication process, eliminating the need for time-consuming post-cut programming and significantly improving productivity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent merges multiple programming operations into a single parallel process that can simultaneously program multiple memory devices on the wafer. By combining what would traditionally be separate sequential programming operations into one parallel operation, the system achieves high-speed programming without requiring individual connections to each memory component.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If conventional individual programming methods are used, then memory devices can be programmed with content, but manufacturing costs increase due to time consumption

Engineering Contradiction:

Improveprogramming processVSAvoidprogramming duration

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The programming operation is performed as a preliminary action during the wafer fabrication process before the wafer is diced into individual dies. This integration of programming into the existing fabrication workflow eliminates additional manufacturing steps and reduces overall production time, thereby lowering manufacturing costs.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs a programming device that can simultaneously program multiple memory devices by copying content to multiple locations in parallel. This copying approach replaces the traditional method of individually programming each device, significantly reducing programming duration while maintaining ease of manufacture.

Inventive Principle:

Principle #26Copying

3Productivity

If parallel programming is implemented on wafer, then productivity increases and manufacturing time decreases, but the system complexity increases

Engineering Contradiction:

Improveprogramming throughputVSAvoidprogramming system structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The programming device is designed with multi-functionality to handle multiple memory devices simultaneously through parallel programming operations. This universal programming system can program different types of memory devices on the wafer using the same hardware infrastructure, achieving high throughput without requiring separate specialized systems for each device type.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces an intermediary programming device that acts as a mediator between the programming source and multiple memory devices on the wafer. This intermediary system enables parallel programming by providing a centralized control mechanism that can simultaneously write data to multiple memory locations without requiring complex individual connections to each device.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS8201258B2Secure personalization of memory-based electronic devices

Publication Date: 2012.06.12 CYPRESS SEMICONDUCTOR CORP

AI summary

Systems and/or methods that facilitate programming content to a plurality of nonvolatile memory devices are presented. A wafer program component facilitates programming content to a plurality of memory devices contained on a wafer. The wafer program component can interface with the wafer and can employ parallel processes to program the memory devices on the wafer at substantially the same time. The content programmed to the memory devices can be the same content or different content. A portion of the content can be access-restricted where authentication information is to be provided in order to be granted access to such content, where access-restricted content can include content associated with subscriptions or personal information of a user(s).