Wafer-Level MEMS Packaging Without Temporary Carrier Debonding

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Solution Overview

Problem

The manufacturing of MEMS packages requires complex structures and a high number of manufacturing steps, posing challenges in terms of process compatibility with subsequent electrical and electronic component manufacturing.

Innovation Solution

The development of wafer level MEMS packages and chip-on-wafer MEMS packages, which involve bonding a MEMS wafer with a capping wafer and a device wafer, respectively, using inter-wafer connectors and redistribution layers to simplify the manufacturing process and improve integration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional MEMS package manufacturing methods are used with complex structures and multiple manufacturing steps, then manufacturing precision can be maintained, but device complexity and manufacturing time increase significantly

Engineering Contradiction:

Improvemanufacturing precisionVSAvoiddevice complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The manufacturing process is segmented into distinct wafer-level operations where MEMS structures are fabricated on separate wafers that are subsequently bonded together. This allows complex MEMS structures to be manufactured independently on simplified wafer substrates, reducing overall process complexity while maintaining precision.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar 2D manufacturing to 3D stacked wafer-level integration. Multiple MEMS structures are fabricated on separate wafers in parallel, then bonded vertically to create three-dimensional integrated packages, reducing manufacturing steps while increasing functional density.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If traditional MEMS package manufacturing with multiple steps is used, then structural complexity can be achieved, but manufacturing throughput decreases

Engineering Contradiction:

Improvestructural complexityVSAvoidmanufacturing throughput

Core Design Contradiction:

Device complexityVSProductivity

Solution Approach 1:

MEMS structures are preliminarily fabricated on separate wafers before final assembly. This preliminary manufacturing on simplified substrates allows parallel processing and eliminates the need for complex in-situ manufacturing steps during final package assembly, thereby increasing throughput.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Multiple separately fabricated MEMS wafers are merged through wafer-level bonding to create integrated packages. This combining approach allows all MEMS structures to be manufactured simultaneously in parallel on different wafers, then integrated in a single bonding step, dramatically improving manufacturing throughput.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If conventional MEMS packaging with temporary carriers is used, then manufacturing flexibility is maintained, but manufacturing cost and process time increase

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoidmanufacturing time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent extracts and eliminates the temporary carrier step from the manufacturing process. MEMS structures are directly fabricated on final package wafers without requiring intermediate carrier substrates, removing the time-consuming carrier bonding and debonding operations while maintaining manufacturing flexibility.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses wafer-level interconnect structures as intermediaries to directly connect MEMS devices to package substrates, eliminating the need for temporary carrier mediators. This direct wafer-to-wafer bonding approach reduces manufacturing time while preserving design flexibility through standardized interconnect interfaces.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the complexity and cost of manufacturing MEMS packages by eliminating the need for temporary carriers and carrier debonding, while also achieving high manufacturing throughput and enabling small form factor, high-performance devices for applications like IoT and wearable electronics.

Implementation Method 1

bonding a MEMS wafer with a capping wafer and a device wafer, respectively, using inter-wafer connectors

Methodology Applied

Scientific EffectBonding: Welding

Data Source

PatentUS12209015B2MEMS packages and methods of manufacture thereof

Publication Date: 2025.01.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Microelectromechanical systems (MEMS) packages and methods of manufacture thereof are described. In an embodiment, a method of manufacturing a MEMS package may include attaching a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed therein to form a wafer level MEMS package; and singulating the device wafer having the MEMS structure attached thereto to form a plurality of chip scale MEMS packages.