Wafer-Level Micro-Optics Integration on VCSELs
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Solution Overview
Problem
Conventional methods for integrating micro-optics with surface-emitting laser diodes (VCSELs) are complex, expensive, and not easily scalable, often resulting in destruction of active alignment during adhesive curing and requiring individual processing and positioning, which limits cost-effectiveness and scalability.
Innovation Solution
A wafer-level operation method where micro-optics are directly positioned and produced on VCSELs, using unfunctionalized photopolymers applied to the wafer, with imprinting of optical functions and bonding with an adhesive layer to create durable, scalable, and cost-effective optics, including transmission holograms, diffractive, and focusing lenses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional individual processing and positioning methods are used, then micro-optics can be positioned on VCSELs, but the process becomes complex and expensive
Solution Approach 1:
The patent merges multiple individual processing steps into a single wafer-level operation. Instead of processing each VCSEL individually, the method processes entire wafers containing multiple VCSELs simultaneously, integrating micro-optics production and positioning into one unified process that reduces complexity while maintaining precision
Solution Approach 2:
The patent creates a universal wafer-level processing method that can handle multiple VCSELs simultaneously. The single-sided V-groove structure serves multiple functions: it provides mechanical support, enables precise positioning, and facilitates batch processing of numerous VCSELs on one wafer, making the process scalable and cost-effective
2Manufacturing precision
If adhesive bonding with active alignment is used, then micro-optics can be positioned on VCSELs, but the active alignment may be destroyed during adhesive curing
Solution Approach 1:
The patent performs preliminary positioning of micro-optics into the single-sided V-grooves before any adhesive bonding or curing processes. The V-grooves are pre-formed with precise dimensions and orientations, allowing micro-optics to be mechanically secured in the correct position before final bonding, thereby preserving alignment throughout the curing process
Solution Approach 2:
The single-sided V-grooves serve as an intermediary structure between the VCSEL substrate and the micro-optics. These grooves provide a mechanical interface that maintains precise alignment and positioning, acting as a stable mediator that prevents direct contact between adhesives and the aligned micro-optics, thus protecting the alignment during curing
3Manufacturing precision
If conventional processing methods are used, then micro-optics can be produced, but scalability is limited and production expenditure increases
Solution Approach 1:
The patent combines multiple VCSEL processing operations into a single wafer-level process. Entire wafers containing multiple VCSELs are processed simultaneously for micro-optics production and positioning, dramatically increasing throughput and scalability while maintaining the same precision as individual processing would provide
Solution Approach 2:
The patent segments the wafer into multiple individual VCSEL regions, each with its own single-sided V-groove structure. This segmentation allows batch processing of many VCSELs simultaneously while maintaining individual precision control for each VCSEL-micro-optics pair, enabling both high productivity and manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables cost-effective and scalable production of VCSELs with integrated optics, achieving precise and durable micro-optics that can be adapted to specific VCSEL characteristics, suitable for applications like smart glasses with high hologram precision and reduced production expenditure.
Implementation Method 1
bonding with an adhesive layer to create durable, scalable, and cost-effective optics
Implementation Method 2
applying unfunctionalized photopolymers applied to the wafer, with imprinting of optical functions
Data Source
AI summary
A method for producing micro-optics on surface-emitting laser diodes. In a wafer-level operation, the micro-optics are preferably positioned directly on the VCSEL's forming, in each instance, a part of a coherent wafer.