Wafer-Level Passive Optical Component Manufacturing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current methods for manufacturing passive optical components are inefficient, requiring numerous steps, being costly, and lacking in integration and precision, particularly when producing large numbers of devices with small dimensions and high optical quality.

Innovation Solution

A method involving a wafer with transparent and non-transparent materials, where transparent elements are filled and hardened, and optical structures are replicated, allowing for efficient and cost-effective production of passive optical components with precise alignment and integration, using techniques like embossing and molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional methods are used to manufacture passive optical components, then manufacturing steps are numerous and costs are high, but manufacturing precision and integration are insufficient

Engineering Contradiction:
Improvealignment precisionVSAvoidmanufacturing steps
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple manufacturing operations (molding, embossing, coating, assembly) into a single integrated wafer-level process. Multiple optical components are manufactured and assembled simultaneously on a common wafer substrate, eliminating sequential steps and achieving precise alignment through the wafer's inherent structural reference system.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from traditional 3D assembly of individual components to a 2D wafer-level parallel processing approach. By arranging multiple optical components and their supporting structures on a flat wafer surface, the method enables simultaneous manufacturing and precise positioning that would be difficult to achieve through conventional sequential assembly.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If conventional manufacturing methods are used, then production efficiency is low, but achieving high optical quality requires numerous steps

Engineering Contradiction:
Improveproduction efficiencyVSAvoidoptical quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent segments the wafer into multiple identical or different optical component units, each with its own transparent element, supporting structure, and optical structure. This segmentation enables parallel independent manufacturing of multiple components simultaneously on a single wafer, dramatically increasing production efficiency while maintaining consistent optical quality across all units through standardized processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary actions by pre-forming the wafer substrate with integrated supporting structures and alignment features before adding the optical elements. The wafer is prepared with molded cavities, embossed patterns, and coating layers in advance, so that subsequent assembly steps can proceed rapidly with precise positioning already established by the pre-formed structural references.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If traditional assembly methods are used, then integration is poor, but achieving precise alignment requires complex procedures

Engineering Contradiction:
Improvealignment precisionVSAvoidassembly simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The wafer substrate serves multiple functions simultaneously: it provides mechanical support for optical elements, establishes precise alignment references through molded and embossed structures, enables parallel assembly of multiple components, and facilitates easy separation into individual units. This multi-functionality eliminates the need for separate alignment and assembly procedures for each component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses the wafer as a master template that copies precise geometric patterns and alignment features to each optical component unit. Through molding and embossing processes, the wafer's structured surface replicates reference patterns across multiple cavities, ensuring that each optical element receives identical positioning information without requiring individual measurement or adjustment.

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method significantly reduces manufacturing steps, enhances integration, and achieves high precision and optical quality, enabling efficient production of passive optical components with improved performance and reduced costs, suitable for large-scale production.

Implementation Method 1

said transparent material being a UV-curable polymer material; applying a replication material to each of said multitude of transparent elements; replicating a structured surface in said replication material; hardening said replication material

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

An optical structure is allocated to each of the transparent elements. The optical structures are manufactured using replication

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 3

Passive optical component: An optical component redirecting light by refraction and/or diffraction and/or reflection

Methodology Applied
Scientific EffectDiffraction: Diffraction

Data Source

PatentEP2735029B1Method for manufacturing passive optical components, and devices comprising the same
Publication Date: 2022.12.21 HEPTAGON MICRO OPTICS PTE LTD
  • EP2735029B1 patent drawingFigure 1~7
  • EP2735029B1 patent drawingFigure 8~12
  • EP2735029B1 patent drawingFigure 13~14

AI summary

The device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of said specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing at least approximately flat surfaces substantially perpendicular to a vertical direction in a distance at least approximately equal to a thickness of said at least one blocking portion (b) measured along said vertical direction, and, attached to said transparent element (6), at least one optical structure (5). The method for manufacturing a device comprising at least one passive optical component (L) comprises providing a wafer comprising at least one blocking portion (b) and a multitude of transparent elements (6).