Wafer Level Optical Module With Non-Overlapping Microstructures
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Solution Overview
Problem
The miniaturization of wafer level optical modules becomes increasingly difficult due to the growing structural complexity and number of optical components, making it challenging to achieve both miniaturization and high integration with effective optical functionality.
Innovation Solution
The design incorporates two optical films with non-overlapping optical microstructures on a substrate, along with a buffer layer and index matching layer, to reduce the overall thickness and enhance optical functionality, allowing for improved integration and functionality within the wafer level optical module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of optical components is increased to meet increasing optical functionality demands, then optical functionality is improved, but device complexity increases and miniaturization becomes more difficult
Solution Approach 1:
The patent merges multiple optical components (lens, reflector, diffuser) into a single integrated optical element with a multi-layer structure. The first optical layer contains a lens with first microstructures, the second optical layer contains a reflector with second microstructures, and the third optical layer contains a diffuser with third microstructures. This integration allows multiple optical functions to be achieved within one component, reducing device complexity while maintaining enhanced optical functionality.
Solution Approach 2:
The integrated optical element serves multiple functions simultaneously: the lens focuses light, the reflector redirects light, and the diffuser scatters light. Each layer performs a distinct optical function, allowing a single component to replace multiple separate optical elements, thereby improving versatility without proportionally increasing complexity.
2Device complexity
If multiple optical components are integrated into a single element, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The optical element is segmented into three distinct optical layers, each with specific microstructures. This segmentation allows each layer to be designed and fabricated with optimized precision requirements for its specific function, rather than requiring the entire component to meet a single high precision standard. The non-overlapping projection design further simplifies manufacturing by ensuring that microstructures in different layers do not interfere with each other during fabrication.
3Volume of moving object
If the thickness of the optical element is reduced for miniaturization, then volume is decreased, but optical functionality may be compromised
Solution Approach 1:
The patent transitions from a conventional single-layer optical component to a multi-layer vertical structure. By stacking multiple optical layers with different functions (lens, reflector, diffuser) in the thickness direction, the design achieves enhanced optical functionality within a compact volume. The non-overlapping projection of microstructures across layers allows light to interact with multiple optical features sequentially as it propagates through the element, effectively packing more optical function into a smaller overall volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the thickness of the optical element, enhances optical functionality, and improves the integration degree of the wafer level optical module, enabling more complex optical designs in a compact form.
Implementation Method 1
The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface.
Implementation Method 2
The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface
Implementation Method 3
The index matching layer is disposed between the substrate and the first optical film
Implementation Method 4
The buffer layer is disposed between the substrate and the second optical film
Data Source
AI summary
An optical element including a substrate, a first optical film and a second optical film. The first optical film and the second optical film are disposed on at least one side of the substrate and are both formed on the substrate. The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface. The orthogonal projection of the first optical microstructures on the substrate does not overlap the orthogonal projection of the second optical microstructures on the substrate. A wafer level optical module adopting the optical element is also provided.