Wafer-Level Optical Module With Transparent Portions And Mirror
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Solution Overview
Problem
Current methods for manufacturing optical modules are limited by high manufacturing tolerances, complexity, and the need for a large number of parts, which hinders the production of compact, high-precision, and miniaturized optical modules with elaborate light paths.
Innovation Solution
The design and manufacturing method involves a modular structure with a first and second member having transparent portions, a mirror element, and an active optical component, where the mirror element is integrated or separate, and a third member acting as a spacer, allowing for compact and precise optical modules with simplified production using wafer-level manufacturing and replication processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods are used for optical modules, then manufacturing process is simpler, but manufacturing precision is poor and tolerances are high
Solution Approach 1:
The patent combines multiple manufacturing operations into a single integrated wafer-level process. The support wafer, optical elements, and housing components are all formed and assembled in one continuous process on the wafer, eliminating the need for separate manufacturing and assembly steps. This merging of operations achieves high manufacturing precision while the integration actually reduces overall process complexity.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the support wafer with integrated optical elements and housing features before final assembly. The wafer is prepared in advance with all necessary components positioned and secured, allowing for precise alignment and reducing the complexity of subsequent assembly operations.
2Volume of moving object
If conventional assembly methods are used, then fewer manufacturing steps are required, but the number of parts increases and compactness decreases
Solution Approach 1:
The patent merges multiple discrete components into a single integrated wafer structure. The support wafer incorporates optical elements, mounting features, and housing components that would traditionally be separate parts. This integration dramatically reduces the number of parts while enabling compact module design with reduced volume.
Solution Approach 2:
The patent transitions from three-dimensional assembly of separate parts to a two-dimensional wafer-based manufacturing approach. By laying out all components on a flat wafer surface and then forming the three-dimensional structure in one process, the patent achieves compactness while reducing part count and manufacturing complexity.
3Productivity
If wafer-level manufacturing is used, then manufacturing precision is high and productivity is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple manufacturing operations into a single wafer-level process that can produce multiple modules simultaneously. By combining support wafer formation, optical element attachment, housing formation, and assembly into one integrated process, the patent achieves high productivity through mass production while the integration reduces the number of separate process steps.
Solution Approach 2:
The patent uses the wafer as a template or copy medium to reproduce identical module components and structures. The wafer-level process creates multiple copies of the same optical module configuration simultaneously, ensuring high precision and consistency across all produced modules while improving productivity through parallel manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient mass-production of compact, high-precision optical modules with elaborate light paths using fewer parts, achieving high precision and reduced manufacturing complexity while maintaining optical quality and sealing.
Implementation Method 1
at least one of said first and second members comprises one or more transparent portions through which light can pass
Implementation Method 2
a mirror element present on said second face
Data Source
AI summary
The optical module (1) comprises—a first member (O) having a first face (F1) which is substantially planar;—a second member (P) having a second face (F2) facing the first face (F1), which is substantially planar and is aligned substantially parallel to the first face;—a third member (S) comprised in the first member (O) or comprised in the second member (P) or distinct from and located between these, which comprises an opening (4);—a mirror element (31′; 31′″) present on the second face (F2); and—an active optical component (26) present on the second face (F2) and electrically connected to the second member (P); wherein at least one of the first and second members comprises one or more transparent portions (t) through which light can pass. The method for manufacturing the optical module (1) comprises the steps of a) providing a first wafer; b) providing a second wafer on which the mirror elements (31′. . . ) are present; c) providing a third wafer, wherein the third wafer is comprised in the first wafer or is comprised in the second wafer or is distinct from these, and wherein the third wafer comprises openings (4); e) forming a wafer stack comprising these wafers; wherein at least one of the first wafer and the second wafer comprises transparent portions (t) through which light can pass.