Wafer Level Optical Module With TSV Electrical Routing
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Solution Overview
Problem
Conventional optical modules using wire bonds for electrical connections are susceptible to trauma, occupy additional space, and increase the thickness of the module, while optical barriers further enhance thickness, limiting component placement and reliability.
Innovation Solution
Integration of light sources and sensors into a wafer using wafer level packaging, where optical components are incorporated directly into the die, with electrical connections routed through the wafer, eliminating wire bonds and providing built-in optical isolation without additional barriers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds are used for electrical connections, then electrical connectivity is achieved, but reliability deteriorates due to susceptibility to trauma
Solution Approach 1:
The patent merges the electrical connection function and optical component mounting into a single integrated wafer substrate. The TSV (through-silicon via) technology combines electrical interconnection with structural support, eliminating the need for separate wire bonds and reducing trauma susceptibility while improving reliability.
Solution Approach 2:
The patent replaces the mechanical wire bond system with an integrated semiconductor interconnection system using TSV and copper fills. This substitution eliminates the fragile mechanical wire bonds that are susceptible to trauma, replacing them with a more robust integrated electrical connection method embedded within the wafer structure.
2Length of stationary object
If wire bonds are used for electrical connections, then electrical connectivity is achieved, but the thickness of the module increases
Solution Approach 1:
The patent merges the electrical connection path with the optical component mounting structure by integrating TSV through the wafer. This consolidation eliminates the need for separate wire bond layers, reducing the overall module thickness while maintaining electrical connectivity functionality.
Solution Approach 2:
The patent transitions from a planar wire bond connection method to a three-dimensional vertical interconnection using TSV. By routing electrical connections through the thickness of the wafer rather than across the surface, the design reduces the horizontal space required and enables a more compact, thinner overall module structure.
3Area of stationary object
If wire bonds are used, then electrical connections are established, but space for component placement is reduced
Solution Approach 1:
The patent merges the electrical interconnection function with the optical component substrate by integrating TSV directly into the wafer structure. This integration eliminates the need for separate wire bond regions, freeing up surface area for additional optical components and enabling more flexible component placement arrangements.
4Object-affected harmful factors
If optical barriers are added for optical isolation, then optical isolation is improved, but the thickness profile increases
Solution Approach 1:
The patent merges the optical isolation function with the existing wafer substrate structure and TSV architecture. By integrating optical barriers into the wafer fabrication process rather than adding separate barrier layers, the design achieves optical isolation without significantly increasing the overall thickness profile.
Data Source
AI summary
A method for manufacturing an optical wafer may include coating multiple optical components with a substrate. The multiple optical components may include a light emitting component and a light detecting component, and each of the optical components may include one or more electrical connections. The method may also include depositing a redistribution layer onto at least one of the electrical connections, wherein the redistribution layer routes the electrical connection within the optical wafer to an external connection. The method may also include depositing a passivation layer over the redistribution layer and depositing a dark photoresist layer on at least the passivation layer. The photoresist layer may operatively reduce optical interference between at least one light emitting component and at least one light detecting component.