Wafer-Level Optical Modules Lateral Alignment
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Solution Overview
Problem
Existing methods for manufacturing optical modules face challenges in achieving high precision, small size, and high yield, particularly in positioning optical components close to each other, due to limitations in vertical alignment of light paths and processing conditions required for different components.
Innovation Solution
The method involves using separate wafers for first and second optical components, where the first wafer bears active components and the second wafer bears passive components, allowing for precise lateral alignment and interconnection without compromising processing conditions, enabling closer component placement than on a single wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If optical components are manufactured on a single wafer, then manufacturing process is simpler, but lateral positioning precision deteriorates and components cannot be positioned close to each other
Solution Approach 1:
The patent divides the manufacturing process into separate wafer stages: first wafer for active optical components, second wafer for passive optical components. This segmentation allows each wafer to be optimized for its specific component type, enabling high-precision lateral positioning while maintaining manufacturing efficiency through specialized processing conditions for each component category.
2Volume of moving object
If optical components are positioned close to each other, then module size is reduced, but processing conditions for different components cannot be maintained
Solution Approach 1:
By segmenting the manufacturing into separate wafers for active and passive components, the patent enables close positioning of components in the final module while maintaining distinct processing conditions for each component type during manufacturing. The separation allows independent optimization of processing parameters for each wafer.
Solution Approach 2:
The patent transitions from a single-plane (2D) manufacturing approach to a multi-layer (3D) stacking architecture. Active components on the first wafer and passive components on the second wafer are positioned close together laterally, then stacked vertically, achieving compact module size while preserving processing condition compatibility through dimensional separation.
3Ease of manufacture
If vertical alignment of light paths is used, then manufacturing is easier, but component placement flexibility is limited
Solution Approach 1:
The patent segments optical components into active components on the first wafer and passive components on the second wafer. This segmentation enables flexible component placement within each wafer layer while maintaining relatively simple vertical alignment processes between layers, thus achieving both manufacturing ease and placement flexibility.
Data Source
AI summary
The method for manufacturing a plurality of optical modules each comprising a first (C1) and a second (C2) optical component comprises the steps of a) providing a first substrate wafer (S1) on which a plurality of the first optical components (C1) is present on a top side of the first substrate wafer; b) providing a second substrate wafer (S2) having a material region which is a continuous laterally defined region in which material of the second substrate is present, wherein a plurality of the second optical components (C2) is present in said material region; c) achieving a lateral alignment of the first (S1) and second (S2) substrate wafers such that each of the first optical components (C1) is present in a laterally defined region not overlapping said material region; d) interconnecting the first and second substrate wafers in said lateral alignment such that the top side of the first substrate wafer faces a bottom side of the second substrate wafer with no further wafer in between. This way, first and second optical components may be placed particularly close to each other.