Wafer-Level Optical Sensor for Compact Device Integration
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Solution Overview
Problem
Current methods for fabricating optical sensors, such as those used in mobile phones and computers, face challenges in reducing size and weight while maintaining precision, leading to increased costs and limitations in miniaturization and application scenarios.
Innovation Solution
The optical sensor is fabricated using wafer level processing to form an optical sensing layer with an array of elements, a light transmitting layer, and a light blocking layer with incident holes, allowing light to pass through and irradiate the sensing elements, packaged as a wafer die, which reduces thickness, size, and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional pasting or assembly methods are used to fabricate optical sensors, then the sensor can be assembled with multiple components, but the thickness and size of the sensor increase
Solution Approach 1:
The patent merges multiple separate components (optical sensing layer, light transmitting layer, light blocking layer with incident holes) into a single integrated wafer structure. By forming all layers on the same substrate using wafer-level processing, the patent eliminates the need for separate assembly steps and reduces the overall sensor thickness while maintaining precise alignment of optical elements.
Solution Approach 2:
The patent transitions from traditional three-dimensional assembly of separate components to a two-dimensional wafer-level integration approach. All optical layers are formed planarly on the same substrate, enabling precise positioning without requiring complex vertical assembly, thereby reducing sensor thickness and simplifying manufacturing.
2Ease of manufacture
If traditional assembly methods are used, then components can be connected structurally, but the fabricating device requirements and costs increase
Solution Approach 1:
The patent combines multiple manufacturing operations into a single wafer-level processing step. All layers (optical sensing layer, light transmitting layer, light blocking layer) are formed on the same substrate simultaneously, eliminating the need for multiple assembly operations and reducing both manufacturing complexity and precision requirements.
Solution Approach 2:
The patent replaces mechanical assembly processes (pasting, aligning, bonding separate components) with wafer-level semiconductor manufacturing processes. This substitution uses standardized photolithography and deposition techniques to form all layers with precise alignment, reducing reliance on complex mechanical positioning systems and lowering fabrication costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the thickness and size of the optical sensor, expanding its application range and improving assembly precision, making it suitable for more compact electronic devices.
Implementation Method 1
the light transmitting layer is coated on the optical sensing layer... the light passes through the one or more light incident holes and transmits through the light transmitting layer
Implementation Method 2
the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer
Implementation Method 3
the optical sensing layer includes an array of optical sensing elements... light can pass through the light-incident holes and irradiate onto the array of optical sensing elements
Data Source
AI summary
The present disclosure provides an optical sensor, an optical distance sensing module and a fabricating method thereof. According to the embodiments of the present disclosure, the optical sensor includes an optical sensing layer, a light transmitting layer and a light blocking layer. The optical sensing layer includes an array of optical sensing elements, the light transmitting layer is coated on the optical sensing layer, and the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer. The optical sensing layer, the light transmitting layer and the light blocking layer are packaged as a wafer die. Light passes through the light incident holes and transmits through the light transmitting layer to irradiate on the array of optical sensing elements. The optical sensor effectively reduces the thickness, size and weight of the optical sensor, thereby expanding the application range of the optical sensor.