Wafer-Level Optoelectronic Module Assembly for Height Uniformity
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Solution Overview
Problem
Existing optoelectronic modules in consumer devices face challenges in achieving uniformity due to manufacturing tolerances, leading to variations in dimensions, particularly height, which affects their compactness and performance in space-constrained applications.
Innovation Solution
A wafer-level manufacturing process involving a transmissive adhesive and an optical filter directly on an optoelectronic component, with a non-transmissive epoxy surrounding both, ensures uniformity by eliminating air gaps and accommodating optical components, and using a vacuum injection molding technique to form singulated modules with precise height control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing processes are used, then production flexibility is maintained, but manufacturing precision and uniformity of module dimensions deteriorate
Solution Approach 1:
The patent merges multiple manufacturing operations into a single wafer-level process. Multiple optoelectronic components are mounted on a common carrier substrate, and subsequent steps (adhesive application, optical filter attachment, epoxy encapsulation, and singulation) are performed in batch mode rather than individually for each component. This merging of operations achieves precise dimensional uniformity across all modules while maintaining manufacturing efficiency.
Solution Approach 2:
The manufacturing process is segmented into distinct wafer-level stages: (1) mounting multiple components on a carrier substrate, (2) applying transmissive adhesive to each component, (3) attaching optical filters, (4) encapsulating with epoxy, and (5) singulating into individual modules. This segmentation allows each stage to be optimized for precision while maintaining batch processing efficiency.
2Volume of moving object
If module size is reduced to meet space constraints, then compactness is improved, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent transitions from individual component assembly to wafer-level batch processing, adding the dimension of parallel manufacturing. By processing multiple components simultaneously on a carrier substrate, the system achieves precise dimensional control for compact modules that would be difficult to obtain through sequential assembly of individual small components.
3Reliability
If transmissive adhesive is used to eliminate air gaps, then optical performance is improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is designed to be self-aligning at the wafer level. The carrier substrate provides a common reference plane, and the batch processing steps automatically ensure consistent adhesive application and optical filter alignment across all components. This self-service approach achieves reliable optical performance without requiring complex individual alignment procedures for each module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process results in more uniform and compact optoelectronic modules with reduced mechanical defects and enhanced performance, suitable for integration into devices like smartphones and portable computing devices, where space is limited.
Implementation Method 1
A transmissive adhesive is disposed directly on the optoelectronic component and is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component
Implementation Method 2
an epoxy laterally surrounding and in contact with side surfaces of the transmissive adhesive and the optical filter. The epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component
Implementation Method 3
holding a PCB wafer in a first vacuum injection molding tool, wherein multiple optoelectronic components are mounted on the PCB wafer
Data Source
AI summary
An apparatus includes an optoelectronic component mounted to a PCB substrate. A transmissive adhesive is disposed directly on the optoelectronic component and is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. The apparatus includes an optical filter disposed directly on the transmissive adhesive. An epoxy laterally surrounds and is in contact with side surfaces of the transmissive adhesive and the optical filter. The epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. In some cases, the epoxy defines a recess directly over the optical filter to accommodate an optical component, such as an optical diffuser. Methods of fabricating the modules are disclosed as well.