Wafer-Level Uniform Coating of Optoelectronic Modules
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Solution Overview
Problem
Current methods for manufacturing optoelectronic modules lack efficient wafer-level techniques for uniformly coating multiple surfaces with a formable material layer, often resulting in incomplete coverage and air pockets due to inadequate material distribution and curing processes.
Innovation Solution
A wafer-level method involving a wafer assembly with a chuck, tool wafer, and module wafer, where a formable material is injected and excess material is ejected using vacuum and pressurized gas, with the assembly rotated to ensure uniform distribution, followed by hardening using reactive, hot, or radiation methods to achieve a consistent material layer on optoelectronic modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional coating methods are used on optoelectronic modules, then the manufacturing process is simple, but the material distribution is non-uniform and air pockets form
Solution Approach 1:
The patent segments the coating process into distinct phases: material injection, vacuum application for distribution, centrifugal spreading through rotation, and controlled ejection of excess material. Each phase addresses specific aspects of uniformity, transforming a single complex coating operation into multiple manageable steps that collectively achieve precise material layer uniformity across all modules on the wafer.
Solution Approach 2:
The patent employs vacuum pressure to draw formable material into the wafer assembly and distribute it uniformly across module surfaces. The vacuum system creates negative pressure that pulls material through capillary action and ensures complete coverage of complex geometries, eliminating air pockets and voids that would form with conventional atmospheric coating methods.
2Manufacturing precision
If material is injected to ensure complete coverage, then uniform coating is achieved, but excess material and air pockets may form
Solution Approach 1:
The patent uses periodic action through cyclic vacuum and centrifugal force application. The vacuum phase draws material in completely, then the rotation phase with centrifugal force ejects excess material and air pockets. This periodic cycling between material introduction and excess removal ensures complete coverage without trapping air, as the alternating forces systematically eliminate voids while maintaining material distribution.
Solution Approach 2:
The patent employs mechanical rotation of the wafer assembly at controlled speeds to generate centrifugal force. This rotation serves as a mechanical action that dynamically distributes material during injection and subsequently ejects excess material and air pockets through centrifugal separation. The controlled vibration and motion prevent material stagnation and ensure uniform settling without void formation.
3Productivity
If wafer-level coating is implemented, then productivity increases, but process control complexity increases
Solution Approach 1:
The wafer assembly system is designed with multi-functionality: the same assembly structure performs material injection, vacuum distribution, centrifugal spreading, and excess material ejection. The tool wafer and module wafer configuration serves multiple purposes including mechanical support, gas-tight sealing, and material transport. This universal design consolidates what would otherwise require multiple separate processing stations into a single integrated system, achieving high productivity without proportional increases in overall process complexity.
Solution Approach 2:
The patent merges multiple coating operations into a single wafer-level process. Instead of coating individual modules separately through multiple handling steps, the method combines material injection, vacuum distribution, centrifugal spreading, and curing into one continuous operation on the entire wafer array. This merging eliminates repeated positioning and handling, dramatically increasing productivity while the integrated nature of the combined process actually reduces overall system complexity compared to multiple separate operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures uniform coating of optoelectronic modules with a formable material layer, preventing air pockets and enhancing the reliability and performance of the modules by ensuring complete coverage and proper curing.
Implementation Method 1
injecting a formable material into the wafer assembly further includes rotating the wafer assembly
Implementation Method 2
applying a vacuum to the wafer assembly
Implementation Method 3
applying pressurized gas to the wafer assembly
Implementation Method 4
hardening the formable material with reactive pressurized gas
Implementation Method 5
hardening the formable material with hot pressurized gas
Implementation Method 6
hardening the formable material layer includes hardening the formable material with radiation
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.