Wafer-Level Optoelectronic Packaging Waveguide Alignment
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Solution Overview
Problem
Conventional optoelectronic packages experience high propagation and reflection losses due to free space light propagation, and have limited operational wavelength bandwidth, requiring complex active alignment techniques and additional components like lenses and grating couplers for efficient optical signal coupling.
Innovation Solution
The development of an optoelectronic package with a sub-mount featuring a multi-layered sub-mount boundary wall and an optical waveguide, where the optical die is attached to the sub-mount and enclosed within a cap to form a hermetically sealed cavity, eliminating free space propagation and using the optical waveguide for direct alignment and coupling with an optical fiber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If free space light propagation is used for transmitting optical signals from the cavity, then the optical signals can be coupled to optical fiber, but high propagation and reflection losses occur
Solution Approach 1:
The patent introduces an optical waveguide as an intermediary medium between the optical die and the optical fiber. The waveguide receives optical signals from the optical die and guides them directly to the optical fiber, eliminating free space propagation. This mediator structure reduces propagation and reflection losses while providing stable alignment without complex active alignment techniques.
2Adaptability or versatility
If conventional optoelectronic packages are used, then optical coupling can be achieved, but the operational wavelength bandwidth is limited
Solution Approach 1:
The patent removes the grating coupler component from the conventional optoelectronic package structure. By eliminating this wavelength-selective component, the system achieves broader operational wavelength bandwidth without the need for additional wavelength-limiting elements, while maintaining efficient optical coupling through the waveguide structure.
3Reliability
If lenses and grating couplers are added for efficient optical coupling, then coupling efficiency improves, but the device complexity and number of components increases
Solution Approach 1:
The patent merges the functions of optical coupling and signal transmission into a single integrated waveguide structure. The waveguide simultaneously provides efficient optical coupling from the optical die and guides the signal to the optical fiber, eliminating the need for separate lenses and grating couplers. This consolidation maintains high coupling efficiency while reducing the total component count.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces propagation losses, increases operational wavelength bandwidth, and eliminates the need for additional components like lenses and grating couplers, achieving high coupling efficiency and simplified manufacturing through wafer-level packaging.
Implementation Method 1
The optical waveguide serves as an interconnection conduit between the optical die and the optical fiber for propagation of the optical signal emitted by the optical die
Data Source
AI summary
A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer. The pre-singulated wafer has a plurality of sub-mounts. A first sub-mount of the plurality of sub-mounts includes an optical waveguide formed on a substrate, a multi-layered sub-mount boundary wall that is formed on the optical waveguide, and a v-groove that is external to the sub-mount boundary wall. A plurality of optical dies are attached to the corresponding plurality of sub-mounts, such that each optical die is aligned to the optical waveguide of the corresponding sub-mount. A cap-wafer including a plurality of caps is attached to the pre-singulated wafer to obtain an encapsulated pre-singulated wafer. The encapsulated pre-singulated wafer is diced to obtain a plurality of optoelectronic packages. The optical waveguide of each optoelectronic package serves as an interconnection conduit between the corresponding optical die and an optical fiber placed in the corresponding v-groove.