Thermally Enhanced Wafer Level Package Heat Dissipation
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Solution Overview
Problem
Wafer level packaging of semiconductor dies lacks effective heat dissipation and protection against chipping, particularly as dies become smaller and thinner, leading to yield reduction and increased risk of damage.
Innovation Solution
The method involves attaching semiconductor dies to a heat-dissipating plate, applying a thermally conductive glue layer, and encapsulating them with materials to form packages that include a heat spreader and conductive connectors, ensuring effective thermal dissipation and protection from chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer level packaging is used to reduce packaging cost and increase throughput, then productivity is improved, but heat dissipation ability deteriorates
Solution Approach 1:
The patent merges the packaging function with heat dissipation function by integrating a heat-dissipating plate into the wafer-level packaging process. The plate is attached to the back surface of the wafer before dicing, combining mechanical support, thermal management, and packaging into a single integrated structure, thereby maintaining high throughput while solving heat dissipation issues.
Solution Approach 2:
The heat-dissipating plate serves multiple functions simultaneously: it provides mechanical support to the thin dies, acts as a thermal management solution by conducting heat away from the die, and serves as a protective layer during handling and packaging. This multi-functionality resolves the contradiction by adding thermal management capability without compromising productivity.
2Productivity
If wafer level packaging is used to reduce cost and increase throughput, then productivity is improved, but protection against chipping deteriorates
Solution Approach 1:
The patent combines the protective function with the heat-dissipating plate by extending the plate to cover the corners and edges of the die. This integrated structure provides mechanical protection against chipping during handling and packaging while maintaining the throughput advantages of wafer-level processing, eliminating the need for separate protective measures.
Solution Approach 2:
The heat-dissipating plate is attached to the back surface of the wafer before dicing and handling operations. This pre-attached plate acts as a protective cushion that prevents chipping of the thin die corners and edges during subsequent processing and handling steps, thereby improving reliability without reducing productivity.
3Length of moving object
If dies are made smaller and thinner to advance semiconductor technology, then device miniaturization is achieved, but susceptibility to chipping increases
Solution Approach 1:
The heat-dissipating plate acts as a counterweight or reinforcement layer attached to the back surface of the thin die. This plate compensates for the mechanical weakness of thin dies by providing additional structural support, particularly at the corners and edges, thereby reducing susceptibility to chipping while allowing the die itself to remain small and thin.
Solution Approach 2:
The protective heat-dissipating plate is attached to the die before any handling or packaging operations occur. This beforehand protection provides a cushioning effect that prevents chipping of the thin die during subsequent processing, transportation, and assembly operations, enabling the use of thinner dies without increasing damage risk.
4Adaptability or versatility
If more circuits and functions are packaged into a single die to increase integration, then functionality is improved, but heat dissipation requirement increases
Solution Approach 1:
The patent merges thermal management functionality with the packaging structure by integrating a heat-dissipating plate directly into the wafer-level packaging process. This plate is attached to the back surface of the high-density die before dicing, providing an immediate thermal management solution that handles the increased heat generation from highly integrated circuits without adding complexity to the packaging process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal dissipation and reduces the likelihood of die chipping, improving handling and reducing costs by integrating heat dissipation into the packaging process.
Implementation Method 1
applying a thermally conductive glue layer
Data Source
AI summary
A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality of packages, each including one of the plurality of dies and a piece of the heat-dissipating plate.