Wafer-Level Packaging Using Composite Material Base
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Solution Overview
Problem
Wafer-level semiconductor packages are susceptible to cracking and require a carrier during manufacturing, which adds cost and complexity, and the complete removal of the carrier adhesive can be difficult or impossible.
Innovation Solution
Incorporating a composite material base made of woven strands embedded in a polymer material, such as fiberglass in epoxy, which serves as a carrier and strengthens the package, eliminating the need for a removable carrier and enhancing mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wafer-level packaging techniques are used to create thin packages, then the package size is reduced, but the package becomes susceptible to cracking
Solution Approach 1:
The patent applies composite materials by combining an encapsulation layer with a reinforcement layer containing a three-dimensional mesh of reinforcement material. This composite structure provides both the thin profile needed for small package size and the mechanical strength to resist cracking, directly resolving the contradiction between miniaturization and structural integrity.
Solution Approach 2:
The reinforcement layer is strategically positioned between the encapsulation layer and the substrate, providing localized strengthening exactly where needed to prevent cracking during handling and operation. This allows the package to maintain thin overall dimensions while having enhanced strength in critical regions.
2Ease of manufacture
If a carrier is used during manufacturing to support the package, then manufacturing support is provided, but additional steps and cost are added to attach and remove the carrier
Solution Approach 1:
The patent merges the carrier function with the final package structure by making the substrate an integral part of the package assembly. The substrate serves as both the manufacturing support carrier and the final mounting platform, eliminating the need for separate carrier attachment and removal steps while reducing overall process complexity.
Solution Approach 2:
The substrate is designed to serve multiple functions: it acts as the manufacturing carrier during assembly, provides mechanical support for the encapsulation layer, and serves as the final mounting platform for the finished package. This multi-functionality eliminates the need for dedicated carrier components and simplifies the manufacturing process.
3Ease of manufacture
If a carrier is used during manufacturing, then support is provided, but complete removal of the carrier adhesive can be difficult or impossible
Solution Approach 1:
The patent extracts the adhesive removal problem by using a substrate that is designed to be permanently integrated with the package rather than a temporary carrier. The substrate is attached using adhesives that are intended to remain in place, eliminating the need for adhesive removal entirely and avoiding the associated difficulties and costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material base makes the package thinner, more resistant to cracking, and performs better in drop tests and mechanical load tests, while integrating seamlessly with existing wafer-level packaging processes.
Implementation Method 1
A composite material base and a top face of the encapsulation layer adhere to one another
Implementation Method 2
the composite material base is made of woven strands embedded in a polymer material
Data Source
AI summary
An electronic package that includes a composite material base. In one embodiment the electronic package is an expanded wafer-level package. The composite material base is composed of woven strands and polymer material. In one embodiment the composite material base is composed of woven fiberglass strands and an epoxy material. In various embodiments the package includes an electronic circuitry layer on one or another face of the composite material base. In other embodiments conductive vias connect the circuitry layers, including a redistribution layer. In yet another embodiment an electronic package is mounted on the composite material base and electrically couples to the circuit of the expanded wafer-level package. The package having the composite material base is mechanically stronger and can be made thinner than a package that relies on an encapsulant material for structure, and resists cracking.