Wafer Level Packaging Infrared Camera Detectors
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Solution Overview
Problem
Conventional infrared cameras are complex and costly due to numerous individual components, requiring external thermal management and complex calibration processes, making them difficult to integrate into systems without specialized knowledge.
Innovation Solution
An integrated infrared camera architecture that combines electronics, thermal management, and optical alignment into a single package using high volume manufacturing processes, featuring a thermally conductive pedestal to isolate the detector and a core housing for simplified design and assembly, along with wafer level packaging techniques for efficient detector production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional infrared camera architecture with separate components is used, then functional performance is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the infrared detector, electrical components, thermal management system, and optical alignment features into a single integrated camera core package. This consolidation reduces device complexity by eliminating the need for multiple separate components and external assemblies, while maintaining all necessary functional performance through careful integration of subsystems within the unified package.
Solution Approach 2:
The integrated camera core package serves multiple functions simultaneously: the pedestal provides both structural support and thermal management, the core housing provides both mechanical enclosure and optical alignment reference, and the detector array provides both imaging and signal processing capabilities. This multi-functionality reduces the overall system complexity while maintaining comprehensive functional performance.
2Temperature
If external thermal management devices are used, then detector temperature control is achieved, but device complexity increases
Solution Approach 1:
The thermal management functionality is merged into the camera core package itself through the pedestal structure. The pedestal provides both mechanical support for the detector array and integrated thermal conduction pathways, eliminating the need for external heat sinks or separate thermal control devices. This integration maintains effective temperature control while reducing overall device complexity.
Solution Approach 2:
The pedestal acts as an intermediary structure that simultaneously provides mechanical support and thermal management functions. It serves as the mediator between the detector array and the external environment, conducting heat away from the detector while maintaining a compact integrated design without requiring external thermal management components.
3Measurement precision
If complex calibration procedures are implemented, then measurement precision is improved, but ease of operation deteriorates
Solution Approach 1:
Optical alignment features are incorporated into the camera core housing during manufacturing, establishing precise alignment references before the camera is deployed. This preliminary action eliminates the need for complex field calibration procedures, as the optical path is pre-aligned at the component level. The alignment features are built-in during production, making the camera ready for immediate use without requiring specialized calibration expertise.
4Reliability
If multiple separate components are used, then functional performance is maintained, but ease of manufacture deteriorates
Solution Approach 1:
Multiple functional components are merged into a single integrated camera core package that can be manufactured as one unified unit. The detector array, electrical components, thermal management structures, and optical alignment features are all integrated into this single package, enabling high-volume manufacturing through standardized processes. This approach maintains functional performance while dramatically improving ease of manufacture compared to assembling multiple separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs, simplifies integration, and eliminates the need for external components and complex calibration, making the infrared camera easier to design and implement into various systems without requiring in-depth infrared domain knowledge.
Implementation Method 1
a pedestal made of a thermally conductive material and having a leg coupled to the substrate, wherein the infrared detector is supported by and thermally coupled to the pedestal, the pedestal thermally isolating the infrared detector from the plurality of electrical components
Data Source
AI summary
An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.