Wafer-Level Projector Pitch Alignment for XR Binocular Displays
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Solution Overview
Problem
Existing Extended Reality (XR) display systems face challenges in aligning right and left projectors for binocular displays, particularly due to the complexity of integrating wafer-level optics (WLO) into XR devices.
Innovation Solution
The system determines a projector pitch based on the lens pitch of a wafer, where the projector pitch is an integer multiple of the lens pitch, allowing for the selection or dicing of the wafer to match the projector pitch, thereby simplifying the alignment of projectors for XR devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wafer-level optics (WLO) are integrated into XR devices, then manufacturing precision and optical performance are improved, but device complexity and alignment difficulty increase
Solution Approach 1:
The wafer is divided into multiple discrete projector elements arranged in a grid pattern, with each projector having a defined pitch relative to others. This segmentation allows independent positioning and alignment of each projector while maintaining overall system precision.
Solution Approach 2:
The system establishes a mathematical relationship where projector pitch is defined as an integer multiple of lens pitch (projector pitch = n × lens pitch). This parameter relationship simplifies alignment by creating a scalable, proportional system that maintains precision across different wafer configurations.
2Ease of manufacture
If projector pitch is determined as an integer multiple of lens pitch, then alignment is simplified and manufacturing is improved, but flexibility in projector spacing is reduced
Solution Approach 1:
The integer multiple relationship creates a universal alignment framework that works across different wafer sizes, lens pitches, and projector configurations. This single mathematical rule (projector pitch = n × lens pitch) provides a multi-functional solution that simplifies manufacturing while accommodating various design requirements through different integer values.
Data Source
AI summary
According to an aspect, a method includes identifying a lens pitch associated with a wafer. The method further includes determining a projector pitch for a first projector and a second projector on the wafer based on the lens pitch. The method also includes selecting a portion of the wafer for a device based on the projector pitch.


