Wafer-Level Redistribution Pattern for Electronic Component Package Fabrication
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Solution Overview
Problem
The existing methods for forming electronic component packages require multiple circuit patterns and dielectric layers, increasing manufacturing complexity and cost due to the need for several operations to redistribute bond pads to terminals.
Innovation Solution
A method where a redistribution pattern is formed on the active surfaces of electronic components in wafer form, which then redistributes bond pads to terminals, followed by a single layer of buildup circuit patterns on the reconstituted wafer, simplifying manufacturing and reducing costs by leveraging pre-singulation efficiencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple circuit patterns and dielectric layers are used to redistribute bond pads to terminals, then the desired electrical connection is achieved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent applies preliminary action by forming the redistribution pattern on the active surface of the electronic component before the component is singulated from the wafer. This early formation allows subsequent manufacturing steps to be simplified, as the routing pattern is already in place and can be used directly after the component is separated and packaged, eliminating the need for additional routing layers that would otherwise be required.
2Reliability
If multiple circuit patterns and dielectric layers are formed, then complete redistribution is achieved, but the number of manufacturing operations increases
Solution Approach 1:
The redistribution pattern is formed on the active surface while the electronic component is still in wafer form, before singulation occurs. This preliminary formation allows the routing to be completed in advance, reducing the number of manufacturing operations required after the component is separated and packaged, thereby improving overall manufacturing efficiency.
3Reliability
If multiple circuit patterns are used for redistribution, then the desired terminal pattern is achieved, but the overall cost increases
Solution Approach 1:
The redistribution pattern is formed on the active surface of the electronic component before singulation from the wafer. This preliminary action allows the routing to be completed while the component is still in a form that enables efficient batch processing, reducing the number of subsequent manufacturing operations and associated costs required to achieve the desired terminal pattern.
Data Source
AI summary
A redistribution pattern is formed on active surfaces of electronic components while still in wafer form. The redistribution pattern routes bond pads of the electronic components to redistribution pattern terminals on the active surfaces of the electronic components. The bond pads are routed to the redistribution pattern terminals while still in wafer form, which is a low cost and high throughput process, i.e., very efficient process.