Wafer Level Sensing Module Crosstalk Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional proximity sensing modules in mobile devices are bulky, occupy large space, and suffer from crosstalk effects and limited sensing angles, making them unsuitable for miniaturization and efficient sensing in modern electronic devices.
Innovation Solution
A wafer level sensing module with a chip substrate hosting a proximity sensing unit and an ambient light sensing unit, featuring a shielding assembly with lenses and a transparent shielding plate, which reduces crosstalk and increases sensing angles, allowing for a smaller form factor and reduced hole size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional package casing is used to house the emitter and receptors, then the sensing module achieves proper isolation and function, but the module occupies a large volume of space inside the smart phone
Solution Approach 1:
The patent embeds the emitter and receptors directly into the chip substrate, nesting the sensing components within the substrate itself rather than housing them in a separate package casing. This integration eliminates the need for external packaging while maintaining proper isolation through the substrate structure, thereby reducing overall volume while preventing crosstalk
Solution Approach 2:
The patent combines the package casing function with the chip substrate by integrating the emitter and receptors directly onto the substrate. This merging of functions eliminates the separate package casing, reducing the module volume while maintaining crosstalk isolation through the substrate's inherent structural properties
2Measurement precision
If the sensing angle of the sensor is increased to achieve better sensing effect, then the sensing performance is improved, but the crosstalk effect in the sensing module increases
Solution Approach 1:
The patent applies different shielding properties to different regions of the chip substrate. The shielding structure is strategically positioned to provide localized protection against crosstalk while allowing wide-angle ambient light sensing. This localized shielding approach enables wide sensing angles without increasing crosstalk, as the shielding is applied only where necessary to block harmful interference
3Volume of moving object
If the height and thickness of the package casing are reduced to enable miniaturization, then the module size is decreased, but the sensing angle of the sensor is restricted
Solution Approach 1:
The patent transitions from a three-dimensional package casing structure to a two-dimensional integrated structure where the emitter and receptors are planarly arranged on the chip substrate. This dimensional change allows the sensing components to be positioned in a compact footprint while maintaining wide sensing angles through optimized lateral positioning, eliminating the need for vertical space that would restrict sensing angle
4Device complexity
If the number of visible holes in mobile devices is reduced to meet market demands, then the device appearance is improved, but the sensing module requires alternative configurations that may increase complexity
Solution Approach 1:
The patent designs the chip substrate to serve multiple functions: it acts as the mounting platform for the emitter and receptors, provides electrical interconnections, offers mechanical support, and incorporates shielding structures. This multi-functionality allows the sensing module to be integrated into the device with minimal visible holes, reducing manufacturing complexity despite the integrated design requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a smaller volume, wider sensing angles, and reduced crosstalk, meeting the demands for miniaturized and efficient sensing in electronic devices with fewer visible holes.
Implementation Method 1
an emitter, a first receptor, and a shielding assembly... the first receptor is configured to receive signals that are emitted from the emitter and reflected by an object
Implementation Method 2
The ambient light sensing unit includes a second receptor... the second receptor are formed on the chip substrate
Implementation Method 3
The first lens is connected between the first shielding member and the second shielding member... the emitter is arranged in a first space defined by the first shielding member, the first lens, the second shielding member
Implementation Method 4
The second lens is connected between the second shielding member and the third shielding member, and the first receptor is arranged in a second space defined by the second shielding member, the second lens, the third shielding member
Implementation Method 5
The ambient light sensing unit includes a second receptor and a transparent shielding plate... the transparent shielding plate corresponds in position to the second receptor
Data Source
AI summary
The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.