Wafer-Level Stacked Lens Module for Compact Image Capture

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Solution Overview

Problem

Conventional wafer-level packaged image capture lens modules face issues with exacerbated optical performances, limitations in substrate and lens replication processes, and alignment inaccuracies, which are not suitable for low module height and small lens scale requirements, leading to suboptimal image quality and increased height of the lens module.

Innovation Solution

A stacked image capture lens module design featuring three compound lenses with specific optical elements, including plano-convex and plano-concave lenses, made from UV curable polymer compounds, which are stacked and integrated with a cover glass hybridized with the image detector to achieve compact and high optical performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional wafer-level packaging technology is used, then manufacturing efficiency is improved, but optical performance deteriorates and alignment accuracy decreases

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidalignment accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent merges the lens element and substrate into a single integrated wafer structure, eliminating separate alignment steps. The lens is formed directly on the substrate using wafer-level processing, ensuring inherent alignment between optical elements and the image sensor, thus resolving the alignment accuracy issue while maintaining manufacturing efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent uses wafer-level replication to mass-produce identical lens- substrate assemblies simultaneously. Multiple copies of the optimized optical design are created in parallel across the wafer, achieving both high manufacturing efficiency and consistent alignment accuracy across all produced units.

Inventive Principle:
Principle #26Copying

2Volume of moving object

If conventional wafer-level packaged lens modules are used, then size reduction is achieved, but optical performance is exacerbated

Engineering Contradiction:
Improvemodule heightVSAvoidoptical performance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent applies local quality optimization by designing specific lens curvature profiles and thickness distributions tailored to the compact wafer-level format. The lens features varying local optical properties (different curvatures, aspheric surfaces) that compensate for the reduced overall size, maintaining high optical performance despite the reduced module height.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes key optical parameters including lens refractive index, curvature radii, and thickness to optimize performance for the compact wafer-level configuration. By carefully adjusting these parameters, the design achieves both reduced module height and maintained optical quality, resolving the contradiction between size reduction and performance.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If plastic lenses are used, then cost is reduced, but optical quality deteriorates

Engineering Contradiction:
ImprovecostVSAvoidoptical quality
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent employs plastic lens materials with specifically selected optical properties (refractive index, Abbe number) that balance cost-effectiveness with optical performance. The composite design may also include anti-reflective coatings or other functional layers that enhance optical quality while maintaining the cost advantages of plastic manufacturing processes.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables compact and high-performance image capture lens modules with improved optical quality and reduced module height, addressing the limitations of conventional designs by optimizing lens arrangement and materials for wafer-scale manufacturing.

Implementation Method 1

made from UV curable polymer compounds

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS8194334B2Image capture lens modules and image capture systems
Publication Date: 2012.06.05 OMNIVISION TECHNOLOGIES INC
  • US8194334B2 patent drawing
  • US8194334B2 patent drawing
  • US8194334B2 patent drawing

AI summary

Image capture lens modules are presented. An image capture lens module includes a first compound lens with a first element and a second element arranged in sequence from an object side to an image side. The second element is a plano-convex lens with a convex surface facing the image side on a paraxial line. A second compound lens includes a third element, a fourth element, and a fifth element arranged in sequence from an object side to an image side. The third element is a plano-convex lens with a convex surface facing the object side on a paraxial line, and the fifth element is a plano-concave lens with a concave surface facing the image side on a paraxial line. A third compound lens includes a sixth element and a seventh element arranged in sequence from an object side to an image side, wherein the sixth element is a plano-convex lens with a convex surface facing the object side on a paraxial line.