Wafer Level Testing Equipment Parallel Stress Pad Configuration
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Solution Overview
Problem
Current Wafer Level Reliability (WLR) testing equipment can only measure one set of stresses for one set of structures at a time, limiting its efficiency and requiring sequential testing of multiple elements, whereas Package Level Reliability (PLR) equipment, although capable of measuring multiple structures, incurs higher costs and has data and confidentiality issues.
Innovation Solution
The testing equipment is enhanced by allowing multiple stress pads to be connected to corresponding source measure units simultaneously, enabling multiple elements to be tested concurrently, with the use of accessory pads to facilitate input signal transmission even when space is occupied, and ensuring each element has a dedicated ground pad to prevent measurement defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If WLR testing equipment measures only one set of stresses of one set of structures in one test, then measurement precision is maintained, but productivity is reduced
Solution Approach 1:
The testing equipment is divided into multiple independent pad groups (first pad group, second pad group, etc.), each capable of independently testing different elements. This segmentation allows parallel testing of multiple elements simultaneously while maintaining dedicated measurement channels for each, thus resolving the contradiction between measurement precision and productivity.
Solution Approach 2:
The testing equipment is designed with multiple pad groups that can simultaneously perform the same testing function on different elements. Each pad group includes stress pads and ground pads that can independently apply stresses and measure responses, enabling the system to test multiple elements in parallel while maintaining the precision of individual measurements.
2Productivity
If PLR testing equipment measures stresses of a plurality of sets of structures at the same time, then productivity is improved, but device complexity and cost increase
Solution Approach 1:
The equipment uses multiple simple pad groups rather than one complex measurement system. Each pad group is a straightforward configuration of stress pads and ground pads, avoiding the need for complex reconfiguration mechanisms while enabling parallel testing of multiple elements.
3Device complexity
If stress pads are connected to source measure units sequentially, then device complexity is reduced, but loss of time increases
Solution Approach 1:
Multiple pad groups are designed to operate simultaneously with their own dedicated source measure units, eliminating the need for sequential connection and reconfiguration. This multi-functional design allows the system to test multiple elements in parallel without increasing operational complexity.
Data Source
AI summary
Embodiments of the present application provide a testing equipment and a testing method. The testing equipment includes: a plurality of pad groups and a plurality of source measure units. Each of the pad groups has a stress pad. The stress pad is configured to connect an element under test. The source measure unit is configured to send an input signal to the element under test through the stress pad and measure an output signal of the element under test to acquire performance parameters of the element under test. The stress pads of at least two of the pad groups are connected to the corresponding source measure units at the same time. The embodiments of the present application help improve the testing efficiency.