Wafer Processing Lid with Annular Gas Flow

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Solution Overview

Problem

Existing closed process chambers for semiconductor wafers face challenges in assembling the chamber without damaging the edge of the annular gap and maintaining effective purging due to material expansion during high-temperature processing, which impairs the purging function.

Innovation Solution

The apparatus features a lid with an annular chamber formed in a chemically-resistant plastic lower plate and a composite fiber-reinforced upper plate, equipped with multiple gas inlets and outlets to create a rotating and radially directed gas flow, utilizing materials like PTFE and ECTFE, and a ring to close the chamber, ensuring a gas-tight enclosure and efficient purging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a resilient material is used for the fluid distribution ring, then the assembly process is simplified, but the material expands during high temperature processing causing the gap to close and impairing the purging function

Engineering Contradiction:

Improveassembly processVSAvoidpurging function

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the material parameters by selecting a chemically-resistant plastic with appropriate thermal expansion characteristics that maintains a consistent gap at the annular chamber edge during high-temperature processing, preventing the gap closure issue while remaining chemically inert to treatment fluids

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The lid is constructed as a composite structure combining a chemically-resistant plastic lower plate with a composite fiber-reinforced upper plate, creating a material system that provides both chemical resistance to treatment fluids and dimensional stability during thermal processing cycles

Inventive Principle:

Principle #40Composite materials

2Reliability

If the annular gap edge is made fragile to achieve precise gap control, then the purging function is improved, but the edge is easily damaged during assembly

Engineering Contradiction:

Improvepurging functionVSAvoidassembly process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the mechanical parameters of the annular chamber edge by using a chemically-resistant plastic material with appropriate strength and toughness properties, allowing the edge to maintain precise dimensional control for effective purging while being robust enough to withstand assembly operations without damage

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If a single-material lid is used, then the manufacturing process is simplified, but the lid cannot simultaneously provide chemical resistance and structural strength

Engineering Contradiction:

Improvemanufacturing processVSAvoidchemical resistance and strength

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the efficiency and uniformity of gas flow within the chamber, providing thorough purging and reducing the risk of damage during assembly and temperature fluctuations, while maintaining a gas-tight environment for wafer processing.

Implementation Method 1

the lower plate that faces into the closed process chamber and is formed from a chemically-resistant plastic

Methodology Applied

Scientific EffectChemical resistance:

Implementation Method 2

the lid comprises an upper plate formed from a composite fiber-reinforced material and a lower plate that faces into the closed process chamber and is formed from a chemically-resistant plastic

Methodology Applied

Scientific EffectThermal stability:

Implementation Method 3

gas inlets communicating with the annular chamber and opening on a surface of the lid facing outwardly of the closed process chamber, and gas outlets communicating with the annular chamber and opening on a surface of the lid facing inwardly of the closed process chamber

Methodology Applied

Scientific EffectGas flow:

Data Source

PatentUS9597701B2Apparatus for treating surfaces of wafer-shaped articles

Publication Date: 2017.03.21 LAM RES AG

AI summary

An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber. The lid comprises an annular chamber, gas inlets communicating with the annular chamber and opening on a surface of the lid facing outwardly of the closed process chamber, and gas outlets communicating with the annular chamber and opening on a surface of the lid facing inwardly of the closed process chamber.